參數(shù)資料
型號(hào): AT17LV256-10SI
廠商: Atmel
文件頁(yè)數(shù): 13/26頁(yè)
文件大?。?/td> 0K
描述: IC SRL CONFG EEPROM 256K 20SOIC
標(biāo)準(zhǔn)包裝: 38
可編程類型: 串行 EEPROM
存儲(chǔ)容量: 256Kb
電源電壓: 3 V ~ 3.6 V,4.5 V ~ 5.5 V
工作溫度: -40°C ~ 85°C
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
供應(yīng)商設(shè)備封裝: 20-SOIC W
包裝: 管件
其它名稱: AT17LV25610SI
20
2321I–CNFG–2/08
AT17LV65/128/256/512/010/002/040
23.2
8P3 – PDIP
2325 Orchard Parkway
San Jose, CA 95131
TITLE
DRAWING NO.
R
REV.
8P3, 8-lead, 0.300" Wide Body, Plastic Dual
In-line Package (PDIP)
01/09/02
8P3
B
D
D1
E
E1
e
L
b2
b
A2 A
1
N
eA
c
b3
4 PLCS
Top View
Side View
End View
COMMON DIMENSIONS
(Unit of Measure = inches)
SYMBOL
MIN
NOM
MAX
NOTE
Notes:
1. This drawing is for general information only; refer to JEDEC Drawing MS-001, Variation BA for additional information.
2. Dimensions A and L are measured with the package seated in JEDEC seating plane Gauge GS-3.
3. D, D1 and E1 dimensions do not include mold Flash or protrusions. Mold Flash or protrusions shall not exceed 0.010 inch.
4. E and eA measured with the leads constrained to be perpendicular to datum.
5. Pointed or rounded lead tips are preferred to ease insertion.
6. b2 and b3 maximum dimensions do not include Dambar protrusions. Dambar protrusions shall not exceed 0.010 (0.25 mm).
A
0.210
2
A2
0.115
0.130
0.195
b
0.014
0.018
0.022
5
b2
0.045
0.060
0.070
6
b3
0.030
0.039
0.045
6
c
0.008
0.010
0.014
D
0.355
0.365
0.400
3
D1
0.005
3
E
0.300
0.310
0.325
4
E1
0.240
0.250
0.280
3
e
0.100 BSC
eA
0.300 BSC
4
L
0.115
0.130
0.150
2
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AT17LV256-10SI SL383 制造商:Atmel Corporation 功能描述:256 KBIT EEPROM, 8 PIN LAP, FU
AT17LV25610SU 制造商:Atmel Corporation 功能描述:
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AT17LV256-10SU SL383 制造商:Atmel Corporation 功能描述:EEPROM Serial-2Wire 256K-Bit 256K x 1 3.3V/5V 20-Pin SOIC T/R 制造商:Atmel Corporation 功能描述:EEPROM SERL-2WIRE 256KBIT 256K X 1 3.3V/5V 20SOIC - Tape and Reel
AT17LV256-10TQC 制造商:ATMEL 制造商全稱:ATMEL Corporation 功能描述:FPGA Configuration EEPROM Memory