
Smart Modular Technologies
Specification ASY90147-1&2
December 10, 2002
Smart Modular Technologies
2
1.
Document Status
To make a request for change, correction, additions or information on references, please
contact:
Product Management
Communication Products Division
Smart Modular Technologies,
4305 Cushing Parkway,
Fremont, CA 94538.USA
+1 (510)-623-1231
2. Reference
[1] Specification of the Bluetooth System, Version 1.1, February 22, 2001.
3. Scope
The intention of this specification is to provide a general guideline on the integration of a
Bluetooth Mini module. The product specification complies with Bluetooth
Specification 1.1 [1].
4. Module General Features and Chipset Description
4.1 Module General Features
The Smart Modular Technologies’ Bluetooth Mini module is based on a Bluetooth
single chip reference design. It is a complete Bluetooth module. The module has the
following general main features:
Small footprint 52-pin BGA package with 0.8mm ball and1.27mm pitch (14.43mm
x
21.47mm
x
3.0mm).
Highly integrated small, thin module built with high-density mounting technology.
Class II device.
On board pin out for direct 50
RF trace connection.
Fully compliant with Bluetooth specification v1.1.
Full speed HCI UART.
USB v1.1 compliant and USB2.0 compatible.
Pulse Code Modulation (PCM) interface.
Programmable Parallel Input Output (PIO) ports.
Serial Peripheral Interface (SPI).
Low power 1.8V operation.
Full speed Bluetooth
TM
operation.
Full speed USB interface supports OHCI and UHCI host interface.
Revision
0.5
0.9
0.92
Date
September 6, 2002
September 23, 2002 Modified Table 1.
October 11, 2002
Comments
First draft
Modified Table 1, mechanical drawing, HCI
stack features.
Modified Table 1 and mechanical drawing.
First formal release version.
0.94
1.0
December 6, 2002
December 10, 2002