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參數(shù)資料
| 型號(hào)： | AS219-000 |
| 廠商： | SKYWORKS SOLUTIONS INC |
| 元件分類： | 開關(guān) |
| 英文描述： | 100 MHz - 2500 MHz RF/MICROWAVE DIVERSITY SWITCH, 0.7 dB INSERTION LOSS |
| 封裝： | GREEN, DIE-9 |
| 文件頁數(shù)： | 4/5頁 |
| 文件大?。?/td> | 325K |
| 代理商： | AS219-000 |
Skyworks Solutions, Inc. Phone [781] 376-3000 Fax [781] 376-3100 sales@skyworksinc.com www.skyworksinc.com
August 9, 2006 Skyworks Proprietary Information Products and Product Information are Subject to Change Without Notice. 200514 Rev. A
PRELIMINARY DATA SHEET AS219-000
4
Performance is guaranteed only under the conditions listed in the specifications table and is
not guaranteed under the full range(s) described by the Absolute Maximum specifications.
Exceeding any of the absolute maximum/minimum specifications may result in permanent
damage to the device and will void the warranty.
CAUTION: Although this device is designed to be as robust as
possible, ESD (Electrostatic Discharge) can damage
this device. This device must be protected at all times
from ESD. Static charges may easily produce poten-
tials of several kilovolts on the human body or
equipment, which can discharge without detection.
Industry-standard ESD precautions must be employed
at all times.
V1
V2
V3
Ant-Tx
Ant-Rx1
Ant-Rx2
VHigh
VLow
Ins. loss
Isolation
VLow
VHigh
VLow
Isolation
Ins. loss
Isolation
VLow
VHigh
Isolation
Ins. loss
Truth Table
VLow = 0–0.2 V.
VHigh = 2.7–5 V.
All other conditions not recommended.
Pin Out
VTX
VRX1
ANT
RX1
GND
RX2
VRX2
GND
TX
0.9 GHz Harmonics vs. Control Voltages
PIN = 34.5 dBm
60
65
70
75
80
85
90
95
2.6
3.0
3.4
3.8
4.2
4.6
5.0
Control Voltages (V)
Harmonics
(dBc)
2nd Harmonic
3rd Harmonic
1.8 GHz Harmonics vs. Control Voltages
PIN = 32 dBm
Control Voltages (V)
Harmonics
(dBc)
60
65
70
75
80
85
90
95
2.6
3.0
3.4
3.8
4.2
4.6
5.0
2nd Harmonic
3rd Harmonic
Characteristic
Value
RF input power
6 W > 500 MHz
0/+7 V Control
Control voltage
-0.2 V, +8 V
Operating temperature
-40 °C to +85 °C
Storage temperature
-65 °C to +150 °C
Absolute Maximum Ratings
Bond pad metalization: gold.
Bond pad dimensions 0.003 (0.075 mm) x 0.003 (0.075 mm).
Back side metalization: none.
See application note, Handling GaAs MMIC Die.
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