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| 型號(hào)： | AS218-000 |
| 英文描述： | Land Pattern and Surface Mount Guide (Footprints)|DC-6 GHz Plastic Packaged and Chip|SPST |
| 中文描述： | 土地格局和表面安裝指南（足跡）|的DC - 6GHz的塑料包裝和芯片|聚苯乙烯 |
| 文件頁數(shù)： | 1/5頁 |
| 文件大小： | 483K |
| 代理商： | AS218-000 |
Skyworks Solutions, Inc.
[781] 376-3000
Fax
[781] 376-3100
Email
sales@skyworksinc.com
www.skyworksinc.com
Specifications subject to change without notice. 10/02A
1
Suggested PCB Land Pattern Designs for
Leaded and Leadless Packages and Detailed
Surface Mount Guidelines for Leadless Packages
Below are sample printed circuit board land pattern
dimensions. These are based on the IPC (Institute for
Interconnecting and Packaging Electronic Circuits) surface
mount design and land pattern standard: IPC-SM-782.
These drawings are for reference only.It is recommended
that you consult with the company doing the component
mounting and soldering to the printed circuit board.These
companies have more information on options (various
possible dimensions) of actual land patterns.
SC-70
0.087
(2.20 mm)
0.055
(1.40 mm)
0.051 (1.30 mm)
0.026
(0.65 mm)
0.020 (0.50 mm)
SOT-23 3 Lead
0.087
(2.20 mm)
0.075
(1.90 mm)
0.037
(0.95 mm)
0.039
(1.00 mm)
0.055
(1.40 mm)
SOD-323
0.095 (2.40 mm)
0.035
(0.90 mm)
0.030
(0.80 mm)
SC-79
0.014 (0.35 mm) NOM.
0.014
(0.35 mm) NOM.
0.053
(1.35 mm) NOM.
SOT-143
0.075 (1.90 mm)
0.039
(1.00 mm)
0.031 (0.80 mm)
0.057 (1.44 mm)
0.039 (1.00 mm) MIN.
0.047 (1.20 mm) MAX.
0.067
(1.70 mm)
0.087
(2.20 mm)
Chip Scale
375
μ
m
600
μ
m
250
μ
m
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