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參數(shù)資料
| 型號： | ARV242 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Array chip resistors size 4 X 0603 |
| 中文描述： | 陣列芯片電阻的大小4 × 0603 |
| 文件頁數(shù)： | 4/6頁 |
| 文件大小： | 113K |
| 代理商： | ARV242 |
ND REQUIREMENTS
y all tests are carried out in accordance with the schedule of
ication 60115-8” category
LCT
/
UCT
/
56
(rated temperature
wer
C
ategory
T
emperature,
U
pper
C
ategory
T
emperature;
t, long term,
56
days). The testing also covers the requirements
by EIA and EIAJ.
are carried out in accordance with IEC publication 60068,
ended basic climatic and mechanical robustness testing
e for electronic components” and under standard atmospheric
according to “IEC 60068-1” subclause 5.3.
Unless otherwise specified the following values apply:
Temperature: 15
°
C to 35
°
C
Relative humidity: 25% to 75%
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
In Table 4 the tests and requirements are listed with reference to the
relevant clauses of “IEC publications 60115-8 and 60068”; a short
description of the test procedure is also given.
In some instances deviations from the IEC recommendations were
necessary for our method of specifying.
All soldering tests are performed with mildly activated flux.
Test procedures and requirements
IEC
60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
ARC241
ARV241
ARC242
ARV242
accordance with the schedule of IEC publication 60115-8
visual examination
no holes; clean surface;
no visible damage
see Table 3
dimensions
(outline; see Fig.3)
resistance
gauge (mm)
applied voltage (+0/
10%):
10
≤
R < 100
: 0.3 V
100
≤
R < 1 k
: 1 V
1 k
≤
R < 10 k
: 3 V
10 k
≤
R < 100 k
: 10 V
100 k
≤
R < 1 M
: 25 V
R
≥
1 M
: 50 V
unmounted chips; 10
±
1 s; 260
±
5
°
C
R
R
nom
:
max.
±
5%
R
R
nom
:
max.
±
1%
R
R
nom
:
max.
±
5%
20 (Tb)
resistance to
soldering heat
no visible damage
R/R max.:
±
(0.5% +0.05
)
R/R max.:
±
(1% +0.05
)
45 (Xa)
component solvent
resistance
solderability
isopropyl alcohol or H
2
O followed by
brushing in accordance with “MIL 202 F”
unmounted chips completely immersed for
2
±
0.5 s in a solder bath at 235
±
2
°
C
no visible damage
20 (Ta)
good tinning (
≥
95% covered);
no visible damage
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