參數(shù)資料
型號(hào)： AR8618ARU
廠商： Analog Devices, Inc.
元件分類： 圓形連接器
英文描述： Circular Connector; No. of Contacts:8; Series:; Body Material:Aluminum Alloy; Connecting Termination:Solder; Connector Shell Size:24; Circular Contact Gender:Socket; Circular Shell Style:Cable Receptacle; Insert Arrangement:24-6 RoHS Compliant: No
中文描述： 精密20兆赫的CMOS軌到軌輸入/輸出運(yùn)算放大器
文件頁數(shù)： 16/16頁
文件大小： 495K
代理商： AR8618ARU
AD8616/AD8618
OUTLINE DIMENSIONS
Rev. A | Page 16 of 16
0.80
0.60
0.40
8°
0°
4
8
5
4.90
BSC
PIN 1
0.65 BSC
3.00
BSC
SEATING
PLANE
0.15
0.00
0.38
0.22
1.10 MAX
3.00
BSC
COPLANARITY
0.10
0.23
0.08
COMPLIANT TO JEDEC STANDARDS MO-187AA
Figure 50. 8-Lead Micro Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters
0.25 (0.0098)
0.17 (0.0067)
1.27 (0.0500)
0.40 (0.0157)
0.50 (0.0196)
0.25 (0.0099)
×
45°
8°
0°
1.75 (0.0688)
1.35 (0.0532)
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0040)
4
1
8
5
5.00(0.1968)
4.80(0.1890)
4.00 (0.1574)
3.80 (0.1497)
1.27 (0.0500)
BSC
6.20 (0.2440)
5.80 (0.2284)
0.51 (0.0201)
0.31 (0.0122)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-012AA
Figure 51. 8-Lead Standard Small Outline Package [SOIC]
(R-8)
Dimensions shown in millimeters and (inches)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COPLANARITY
0.10
14
8
7
1
6.20 (0.2441)
5.80 (0.2283)
4.00 (0.1575)
3.80 (0.1496)
8.75 (0.3445)
8.55 (0.3366)
1.27 (0.0500)
BSC
SEATING
PLANE
0.25 (0.0098)
0.10 (0.0039)
0.51 (0.0201)
0.31 (0.0122)
1.75 (0.0689)
1.35 (0.0531)
8°
0°
0.50 (0.0197)
0.25 (0.0098)
1.27 (0.0500)
0.40 (0.0157)
0.25 (0.0098)
0.17 (0.0067)
COMPLIANT TO JEDEC STANDARDS MS-012AB
×
45°
Figure 52. 14-Lead Standard Small Outline Package [SOIC]
(R-14)
Dimensions shown in millimeters and (inches)
4.50
4.40
4.30
14
8
7
1
6.40
BSC
PIN 1
5.10
5.00
4.90
0.65
SEATING
PLANE
0.15
0.05
0.30
0.19
1.20
MAX
1.05
1.00
0.80
0.20
0.09
8°
0°
0.75
0.60
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
Figure 53. 14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD8616ARM-R2
AD8616ARM-REEL
AD8616AR
AD8616AR-REEL
AD8616AR-REEL7
AD8618AR
AD8618AR-REEL
AD8618AR-REEL7
AD8618ARU
AR8618ARU-REEL
Temperature Range
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
–40°C to +125°C
Package Description
8-Lead MSOP
8-Lead MSOP
8-Lead SOIC
8-Lead SOIC
8-Lead SOIC
14-Lead SOIC
14-Lead SOIC
14-Lead SOIC
14-Lead TSSOP
14-Lead TSSOP
Package Outline
RM-8
RM-8
R-8
R-8
R-8
R-14
R-14
R-14
RU-14
RU-14
Branding Code
BLA
BLA
2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04648–0–4/04(A)
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