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參數(shù)資料
| 型號： | APC08Y08-W |
| 英文描述： | Non-Isolated DC/DC Power Module |
| 中文描述： | 非隔離DC / DC電源模塊 |
| 文件頁數(shù)： | 21/23頁 |
| 文件大小： | 2632K |
| 代理商： | APC08Y08-W |
Technical Reference Note (APC08)
MODEL: APC08 SERIES
OCTOBER 4, 2004 - REVISION 03
SHEET 21 OF 23
RECOMMENDED REFLOW PROFILE
0
20
40
60
80
100
120
140
160
180
200
220
240
0
30
60
90
120
150
180
210
240
270
300
TIME (seconds)
T
PRE-HEAT ZONE
120 - 180 sec
REFLOW
ZONE
< 80 sec
110
°
C
183
°
C
PEAK TEMPERATURE
200
°
C - 230
°
C
SLOPE
< 4
°
C /sec
RECOMMENDED LOCATION FOR PICK AND PLACE
The flat top surface of the large inductor (topside of the board) provides a versatile and convenient way of picking up the
module (see Figure 46). A 6-7mm outside diameter nozzle from a conventional SMD machine is recommended to attain
maximum vacuum pick-up. Nozzle travel and rotation speed should be controlled to prevent this off-centered picked-up
module from falling off the nozzle. The use of vision recognition systems for placement accuracy will be very helpful.
REFLOW NOTES / RECOMMENDATIONS
1. Refer to the recommended Reflow Profile per
Figure 47. Profile parameters exceeding the
recommended maximums may result to
permanent damage to the module.
2. The module is recommended for topside
reflow process to the host card. For other
orientations, contact factory.
3. In the event that the module needs to be
desoldered from the host card, some pins
may be detached from the module.
MODULE MARKINGS / LABELS
Marking shall be permanent and legible.
Please refer to Figure 48 for the module
marking/ label detail.
Note
1
MMM
FFF
Note
2
YYWW
D
PP
LL
Note
3:
Barcode
Model No
Option
Year / Work Week
Day of Week
nth Panel of the day
Location in the panel
6 & 7 characters / line
Code 128, 32CPI
0.070" Height
Figure 48. Module Label
APC08MMMFFF
YYWWDPPLL
Figure 47. Recommended Reflow Profile.
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