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參數(shù)資料
| 型號(hào)： | AP8801SG-13 |
| 廠商： | DIODES INC |
| 元件分類(lèi)： | 穩(wěn)壓器 |
| 中文描述： | SWITCHING REGULATOR, 500 kHz SWITCHING FREQ-MAX, PDSO8 |
| 封裝： | GREEN, SOP-8 |
| 文件頁(yè)數(shù)： | 4/11頁(yè) |
| 文件大小： | 149K |
| 代理商： | AP8801SG-13 |
AP8801
500mA LED Step-down Converter
Absolute Maximum Ratings
Symbol
V
IN
VIN pin voltage
V
SW
SW voltage
T
J
Junction Temperature
T
LEAD
Lead Temperature Soldering
T
ST
Storage Temperature Range
AP8801 Rev. 4
DECEMBER 2009 DS31765
Diodes Incorporated
Parameter
Rating
-0.3~50
-0.3~50
150
300
-65 to +150
Unit
V
V
o
C
o
C
o
C
Caution:
The absolute maximum ratings are rated values exceeding which the product could suffer physical damage. These values must therefore not
be exceeded under any condition.
Recommended Operating Conditions
Symbol
T
A
Ambient Temperature Range
Duty Cycle Using Inductor
≥
100μH (Note 3)
Semiconductor devices are ESD sensitive and may be damaged by exposure to ESD events. Suitable ESD precautions should be taken
when handling and transporting these devices
Parameter
Min
-40
0.1
Max
105
0.95
Unit
oC
Notes: 3. For most applications the LED current will be within 8% over the duty cycle range specified. Duty cycle accuracy is also dependent on
propagation delay. Smaller size inductors can be used but LED current accuracy may be greater than 8% at extremes of duty cycle. This is
most noticeable at low duty cycles (less than 0.1) or when the input voltage is high and only one LED is being driven.
Electrical Characteristics
(V
IN
=24V, T
A
=25
o
C, unless otherwise specified)
Symbol
Parameter
V
IN
Operating Input Voltage
I
OUT
Continuous switch current
(Note 4)
I
Q
Quiescent Current
F
OSC
Switching Frequency
V
THD
Internal Threshold Voltage
V
REF
Internal Reference Voltage
SET
SET pin input current
V
SET
=V
IN
-0.2
Rds(on) On Resistance of MOSFET
I
SW
=0.4A
I
SW Leakage
Switch leakage current
EN
Voltage High
ON
EN
Voltage Low
OFF
θ
JA
Junction-to-Ambient
MSOP-8L (Note 5)
θ
JC
Junction-to-Case
MSOP-8L (Note 5)
Notes: 4. Refer to figure 6 for the device derating curve.
5. Test condition for SOP-8L and MSOP-8L: Device mounted on FR-4 PCB, 2”x2”, 2oz copper, minimum recommended pad layout on top layer
and thermal vias to bottom layer ground plane. For better thermal performance, larger copper pad for heat-sink is needed.
Conditions
Min
8.0
-
-
184
-
-
Typ.
-
78
-
200
1.25
7
0.7
-
-
-
88
128
58
90
Max
48
500
120
0.5
216
-
-
1.15
8
-
0.2
-
-
-
-
Unit
V
mA
μ
A
MHz
mV
V
μ
A
μ
A
V
V
°
C/W
°
C/W
°
C/W
°
C/W
-
1.25
-
-
-
-
-
Thermal Resistance
SOP-8L (Note 5)
Thermal Resistance
SOP-8L (Note 5)
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