
150mA RF ULDO REGULATOR AP2202
Preliminary Datasheet
5
Aug. 2005 Rev. 1. 3
BCD Semiconductor Manufacturing Limited
Parameter
Symbol
Value
Unit
Supply Input Voltage
V
IN
15
V
Enable Input Voltage
V
EN
15
V
Power Dissipation
P
D
Internally Limited
W
Lead Temperature (Soldering, 5sec)
T
LEAD
260
o
C
Storage Temperature
T
STG
-65 to 150
o
C
ESD (Machine Model)
200
V
Thermal Resistance
θ
JA
(Note 2)
Note 1:
Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.
Note 2: Electrical specifications do not apply when operating the device outside of its operating ratings. The maximum allow-
able power dissipation is a function of the maximum junction temperature, T
J(max),
the junction-to-ambient thermal resistance,
θ
JA,
and the ambient temperature, T
A.
The maximum allowable power dissipation at any ambient temperature is calculated
using: P
D(max)
=(T
J(max)
-T
A
)/
θ
JA.
Exceeding the maximum allowable power dissipation will result in excessive die tempera-
ture, and the regulator will go into thermal shutdown.
Parameter
Symbol
Min
Max
Unit
Supply Input Voltage
V
IN
2.5
13.2
V
Enable Input Voltage
V
EN
0
13.2
V
Operating Junction Temperature
T
J
-40
125
o
C
Recommended Operating Conditions
Absolute Maximum Ratings (Note 1)