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    參數(shù)資料
    型號: AN231E04-E2-QFNSP
    廠商: Electronic Theatre Controls, Inc.
    英文描述: Dynamically Reconfigurable dpASP
    中文描述: 動態(tài)可重構(gòu)dpASP
    文件頁數(shù): 20/24頁
    文件大小: 445K
    代理商: AN231E04-E2-QFNSP
    AN231E04 Datasheet – Dynamically Reconfigurable dpASP
    DS231000-U001d
    - 20 -
    MECHANICAL AND HANDLING
    The AN231E04 comes in the industry standard 44 lead QFN package.
    Dry pack handling is recommended. The package is qualified to MSL3 (JEDEC Standard, J-STD-020A, Level 3). Once the
    device is removed from dry pack, 30°C at 60% humidity for not longer than 168 hours is the maximum recommended
    exposure prior to solder reflow. If out of dry pack for longer than this recommended period of time, then the recommended
    bake out procedure prior to solder reflow is 24 hours at 125°C.
    The package is compliant with RoHS and is Lead-free. Lead finish is Matt tin (Sn-Cu).
    All dimension are in mm
    Symbol
    Min
    Nom
    Max
    A
    -
    -
    0.90
    A1
    0.00
    0.01
    0.05
    A2
    -
    0.65
    0.70
    A3
    -
    0.20
    -
    D
    -
    7.00
    -
    D1
    -
    6.75
    -
    D2
    5.30
    5.50
    5.70
    b
    0.20
    0.25
    0.32
    e
    -
    0.50
    -
    f
    0.26
    0.42
    0.60
    g
    0.2
    -
    -
    Q1
    0.0’ (Ang.deg. )
    12’
    R
    0.09
    -
    -
    1
    2
    3
    4
    5
    6
    7
    8
    9
    10
    32
    33
    CS2b
    CS1b
    SCLK
    VREFN
    BVSS
    CFGFLGb
    VREFP
    VMR
    I4P
    BVDD
    30
    31
    28
    29
    26
    27
    24
    25
    11
    23
    12 13 14 15 16 17
    19
    20
    18
    21
    22
    44
    43 42 41 40 39
    37
    36
    38
    35
    34
    I4N
    M
    S
    E
    L
    S
    D
    D
    R
    A
    I2P
    AVD
    O2
    I2N
    AVSS
    O2
    O1
    O1
    I1N
    I1P
    I3P
    I
    O
    O
    I
    I
    I
    I
    I
    O
    I
    O
    A
    AN231E04
    M
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