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參數(shù)資料
| 型號： | AMMP-6545-BLKG |
| 元件分類： | 混頻器 |
| 英文描述： | 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| 封裝： | 5 X 5 MM, LEAD FREE, SMT, 8 PIN |
| 文件頁數(shù)： | 6/7頁 |
| 文件大?。?/td> | 340K |
| 代理商： | AMMP-6545-BLKG |
6
AMMP-6545 Part Number Ordering Information
Part Number
Devices per
Container
AMMP-6545-BLKG
10
Antistatic bag
AMMP-6545-TR1G
100
7” Reel
AMMP-6545-TR2G
500
7” Reel
Figure 14. Suggested lead-free reow prole for SnAgCu solder paste
TIME (SECONDS)
300
250
200
150
100
50
0
50
100
150
200
250
300
0
TEMPERA
TURE
(
°C)
PEAK = 250 ± 5°C
MELTING POINT = 218°C
RAMP 1
RAMP 2
REFLOW
COOLING
PREHEAT
Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder
paste. Please see recommended solder reow prole.
Neither Conductive epoxy or hand soldering is
recommended.
x Apply solder paste using a stencil printer or dot
placement. The volume of solder paste will be
dependent on PCB and component layout and
should be controlled to ensure consistent mechani-
cal and electrical performance.
x Follow solder paste and vendor’s recommendations
when developing a solder reow prole. A standard
prole will have a steady ramp up from room temper-
ature to the pre-heat temp. to avoid damage due to
thermal shock.
x Packages have been qualied to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
prole will not expose device beyond these limits.
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 13. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB
pad. Reducing stencil opening can potentially generate
more voids underneath. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads. Consid-
ering the fact that solder paste thickness will directly
aect the quality of the solder joint, a good choice is to
use a laser cut stencil composed of 0.127 mm (5 mils)
thick stainless steel which is capable of producing the
required ne stencil outline.
The most commonly used solder reow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reow prole for automated
reow processes is shown in Figure 14. This prole is
designed to ensure reliable nished joints. However, the
prole indicated in Figure 1 will vary among dierent
solder pastes from dierent manufacturers and is shown
here for reference only.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMP-6545-TR1G | 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| AMMP-6545-TR2G | 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| AMP-11-2 | 5 MHz - 1000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMP-11-2+ | 5 MHz - 1000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMP-2000 | 10 MHz - 2000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6545-TR1G | 功能描述:射頻混合器 SubHarmonic Mixer 18-45GHz MMIC RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6545-TR2G | 功能描述:射頻混合器 SubHarmonic Mixer 18-45GHz MMIC RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6546-BLKG | 功能描述:射頻放大器 SubHarmonic Mixer 18-45GHz MMIC RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6546-TR1G | 功能描述:射頻放大器 SubHarmonic Mixer 18-45GHz MMIC RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6546-TR2G | 功能描述:射頻放大器 SubHarmonic Mixer 18-45GHz MMIC RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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