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參數(shù)資料
| 型號(hào)： | AMMP-6530 |
| 廠商： | AGILENT TECHNOLOGIES INC |
| 元件分類(lèi)： | 混頻器 |
| 英文描述： | 5000 MHz - 30000 MHz RF/MICROWAVE IMAGE REJECTION MIXER, 10 dB CONVERSION LOSS-MAX |
| 封裝： | 5 X 5 MM, SURFACE MOUNT PACKAGE-8 |
| 文件頁(yè)數(shù)： | 3/3頁(yè) |
| 文件大?。?/td> | 83K |
| 代理商： | AMMP-6530 |
This preliminary data is provided to assist you in the evaluation of product(s) currently under development. Until Agilent Technologies releases
this product for general sales, Agilent Technologies reserves the right to alter prices, specifications, features, capabilities, functions, release dates,
and remove availability of the product(s) at anytime.
Revision Date: 4/28/04
Revision Number: 5.0
Outline Drawing
Suggested PCB Material and Land Pattern
.097 [2.46]
.011 [0.28]
.034 [0.85]
.012 [0.3]
.020 [0.5]
.059 [1.5]
.276 [7.0]
.016 [0.40]
Evaluation Test Circuit (Demo Board)
(Available to customer on qualified request)
Recommended SMT Attachment
The AMMP Packaged Devices are compatible with
high volume surface mount PCB assembly processes.
The PCB material and mounting pattern, as defined in
the data sheet, optimizes RF performance and is
strongly recommended. An electronic drawing of the
land pattern is available from www.agilent.com/view/rf
or upon request from Agilent Application Engineering.
Manual Assembly for Prototypes
1.
Follow ESD precautions while handling packages.
2.
Handling should be along the edges with tweezers
or from topside if using a vacuum collet.
3.
Recommended attachment is solder paste. Please
see recommended solder reflow profile.
Conductive epoxy is not recommended. Hand
soldering is not recommended.
4.
Apply solder paste using either a stencil printer or
dot placement. The volume of solder paste will be
dependent on PCB and component layout and
should be controlled to ensure consistent
mechanical and electrical performance.
Excessive solder will degrade RF performance.
5.
Follow solder paste and vendor’s
recommendations when developing a solder
reflow profile. A standard profile will have a
steady ramp up from room temperature to the pre-
heat temperature to avoid damage due to thermal
shock.
6.
Packages have been qualified to withstand a peak
temperature of 235
°C for 15 seconds. Verify that
the profile will not expose device beyond these
limits.
7.
Clean off flux per vendor’s recommendations.
8.
Clean the module with Acetone. Rinse with
alcohol. Allow the module to fully dry before
testing.
25
50
75
100
125
150
175
200
225
01 234 56 78
TIME (minutes)
T
e
mperature
(
°C
)
Recommended solder reflow profile
For product information and a complete list of Agilent
contacts and distributors, please go to our website:
www.agilent.com/semiconductors
E-mail: SemiconductorSupport@agilent.com
Data subject to change.
Copyright 2004 Agilent Technologies, Inc.
NOTES:
1.
INIDICATES PIN 1
2.
DIMENSIONS ARE IN
INCHES [MILIMETERS]
3.
ALL GROUNDS MUST
BE SOLDERED TO PCB
RF GROUND
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6530-BLK | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6530-TR1 | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6530-TR2 | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6532-BLKG | 功能描述:射頻無(wú)線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
| AMMP-6532-TR1G | 功能描述:射頻無(wú)線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
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