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參數(shù)資料
| 型號(hào)： | AMMP-6522-TR2G |
| 元件分類： | 放大器 |
| 英文描述： | 7000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 5 X 5 MM, LEAD FREE, SMT, 8 PIN |
| 文件頁(yè)數(shù)： | 8/9頁(yè) |
| 文件大?。?/td> | 346K |
| 代理商： | AMMP-6522-TR2G |
8
Manual Assembly
x Follow ESD precautions while handling packages.
x Handling should be along the edges with tweezers.
x Recommended attachment is conductive solder
paste. Please see recommended solder reflow profile.
Neither Conductive epoxy or hand soldering is
recommended.
x Apply solder paste using a stencil printer or dot place-
ment. The volume of solder paste will be dependent
on PCB and component layout and should be con-
trolled to ensure consistent mechanical and electrical
performance.
x Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room temper-
ature to the pre-heat temp. to avoid damage due to
thermal shock.
x Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads. The recommended stencil layout is
shown in Figure 21. The stencil has a solder paste depo-
sition opening approximately 70% to 90% of the PCB
pad. Reducing stencil opening can potentially gener-
ate more voids underneath. On the other hand, stencil
openings larger than 100% will lead to excessive solder
paste smear or bridging across the I/O pads. Considering
the fact that solder paste thickness will directly affect the
quality of the solder joint, a good choice is to use a laser
cut stencil composed of 0.127mm (5 mils) thick stainless
steel which is capable of producing the required fine
stencil outline.
The most commonly used solder reflow method is ac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 22. This profile is
designed to ensure reliable finished joints. However, the
profile indicated in Figure 1 will vary among different
solder pastes from different manufacturers and is shown
here for reference only.
Figure 22. Suggested lead-free Reow Prole for SnAgCu solder paste
TIME (SECONDS)
300
250
200
150
100
50
0
50
100
150
200
250
300
0
TEMPERA
TURE
(°
C)
PEAK = 250
± 5°C
MELTING POINT = 218
°C
RAMP 1
RAMP 2
REFLOW
COOLING
PREHEAT
AMMP-6522 Part Number Ordering Information
Part Number
Devices per Container Container
AMMP-6522-BLKG
10
Antistatic bag
AMMP-6522-TR1G
100
7” Reel
AMMP-6522-TR2G
500
7” Reel
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMP-6545-BLKG | 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| AMMP-6545-TR1G | 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| AMMP-6545-TR2G | 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| AMP-11-2 | 5 MHz - 1000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMP-11-2+ | 5 MHz - 1000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6530 | 制造商:AGILENT 制造商全稱:AGILENT 功能描述:5-30 GHz Image Reject Mixer |
| AMMP-6530-BLK | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6530-TR1 | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6530-TR2 | 功能描述:射頻混合器 Mixer MMIC 5-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMP-6532-BLKG | 功能描述:射頻無(wú)線雜項(xiàng) LNA IR Mixer 20-33GHz RoHS:否 制造商:Texas Instruments 工作頻率:112 kHz to 205 kHz 電源電壓-最大:3.6 V 電源電壓-最小:3 V 電源電流:8 mA 最大功率耗散: 工作溫度范圍:- 40 C to + 110 C 封裝 / 箱體:VQFN-48 封裝:Reel |
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