參數(shù)資料
型號(hào): AMMP-6420
廠商: AGILENT TECHNOLOGIES INC
元件分類: 放大器
英文描述: 6000 MHz - 18000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER
封裝: 5 X 5 MM, SURFACE MOUNT PACKAGE-8
文件頁數(shù): 4/4頁
文件大?。?/td> 86K
代理商: AMMP-6420
This preliminary data is provided to assist you in the evaluation of product(s) currently under development. Until Agilent Technologies
releases this product for general sales, Agilent Technologies reserves the right to alter prices, specifications, features, capabilities,
functions, release dates, and remove availability of the product(s) at anytime.
Revision Date: 4/28/04
Revision Number: 5.0
Outline Drawing
Suggested PCB Material and Land Pattern
Evaluation Test Circuit (Demo Board)
(Available to customer on qualified request)
Recommended SMT Attachment
The AMMP Packaged Devices are compatible with
high volume surface mount PCB assembly processes.
The PCB material and mounting pattern, as defined in
the data sheet, optimizes RF performance and is
strongly recommended. An electronic drawing of the
land pattern is available from www.agilent.com/view/rf
or upon request from Agilent Application Engineering.
Manual Assembly for Prototypes
1.
Follow ESD precautions while handling packages.
2.
Handling should be along the edges with tweezers
or from topside if using a vacuum collet.
3.
Recommended attachment is solder paste. Please
see recommended solder reflow profile.
Conductive epoxy is not recommended. Hand
soldering is not recommended.
4.
Apply solder paste using either a stencil printer or
dot placement. The volume of solder paste will be
dependent on PCB and component layout and
should be controlled to ensure consistent
mechanical and electrical performance.
Excessive solder will degrade RF performance.
5.
Follow solder paste and vendor’s
recommendations when developing a solder
reflow profile. A standard profile will have a
steady ramp up from room temperature to the pre-
heat temperature to avoid damage due to thermal
shock.
6.
Packages have been qualified to withstand a peak
temperature of 235
°C for 15 seconds. Verify that
the profile will not expose device beyond these
limits.
7.
Clean off flux per vendor’s recommendations.
8.
Clean the module with Acetone. Rinse with
alcohol. Allow the module to fully dry before
testing.
25
75
125
175
225
012
3456
78
TIME (minutes)
Tem
per
at
ur
e
(
°
C
)
Recommended solder reflow profile
For product information and a complete list of Agilent
contacts and distributors, please go to our website:
www.agilent.com/semiconductors
E-mail: SemiconductorSupport@agilent.com
Data subject to change.
Copyright 2004 Agilent Technologies, Inc.
NOTES:
1.
INIDICATES PIN 1
2.
DIMENSIONS ARE IN
INCHES [MILIMETERS]
3.
ALL GROUNDS MUST
BE SOLDERED TO PCB
RF GROUND
相關(guān)PDF資料
PDF描述
AMMP-6522-TR1G 7000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6522-TR2G 7000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
AMMP-6545-BLKG 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX
AMMP-6545-TR1G 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX
AMMP-6545-TR2G 18000 MHz - 40000 MHz RF/MICROWAVE DOUBLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX
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