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參數(shù)資料
| 型號(hào)： | AMMP-6345-TR2G |
| 元件分類： | 放大器 |
| 英文描述： | 18000 MHz - 45000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 5 X 5 MM, 2 MM HEIGHT, SURFACE MOUNT PACKAGE-8 |
| 文件頁數(shù)： | 9/10頁 |
| 文件大?。?/td> | 685K |
| 代理商： | AMMP-6345-TR2G |
8
Manual Assembly
1. Follow ESD precautions while handling packages.
2. Handling should be along the edges with tweezers.
3. Recommended attachment is conductive solder
paste. Please see recommended solder reflow profile.
Conductiveepoxyisnotrecommended.Handsoldering
is not recommended.
4. Apply solder paste using a stencil printer or dot
placement.
The volume of solder paste will be
dependent on PCB and component layout and should
be controlled to ensure consistent mechanical and
electrical performance.
5. Follow solder paste and vendor’s recommendations
when developing a solder reflow profile. A standard
profile will have a steady ramp up from room
temperature to the pre-heat temperature to avoid
damage due to thermal shock.
6. Packages have been qualified to withstand a peak
temperature of 260°C for 20 seconds. Verify that the
profile will not expose device beyond these limits.
Solder Reflow Profile
The most commonly used solder reflow method is accom-
plished in a belt furnace using convection heat transfer.
The suggested reflow profile for automated reflow pro-
cesses is shown in Figure 16. This profile is designed to
ensure reliable finished joints. However, the profile will
vary among different solder pastes from different manu-
facturers and is shown here for reference only.
Figure 16. Suggested lead free reflow profile for SnAgCu solder paste
3 2
1
4
8
BACK VIEW
0.012 (0.30)
0.016 (0.40)
0.014 (0.365)
0.011 (0.28)
0.018 (0.46)
0.114 (2.90)
0.100 (2.54)
0.059
(1.5)
0.126
(3.2)
0.029 (0.75)
5
6 7
0.016 (0.40)
0.93 (2.36)
0.028 (0.70)
DIMENSIONAL TOLERANCE FOR BACK VIEW: 0.002" (0.05 mm)
1 2
3
7 6
5
4
8
.075 [1.91]
.200 [5.08]
AMMP
XXXX
YWWDNN
FRONT VIEW
SIDE VIEW
*
Outline Drawing
Figure 17. Package Outline Drawing
Notes:
Indicates Pin 1 (Back Side of Package)
Dimensions are in inches [millimeters]
All grounds must be soldered to PCB RF ground
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temperature
-
°C
Peak = 250 ± 5 °C
Ramp 1 Preheat Ramp 2 Reflow
Melting point = 218°C
Cooling
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6408 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 to 18 GHz 1 W Power Amplifier in SMT Package |
| AMMP-6408_08 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 to 18 GHz 1 W Power Amplifier in SMT Package |
| AMMP-6408-BLKG | 功能描述:射頻放大器 P-Amp MMIC 6-18GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6408-TR1G | 功能描述:射頻放大器 P-Amp MMIC 6-18GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6408-TR2G | 功能描述:射頻放大器 P-Amp MMIC 6-18GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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