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參數(shù)資料
| 型號(hào)： | AMMP-6233-BLKG |
| 元件分類： | 放大器 |
| 英文描述： | 18000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 5 X 5 MM, 1.25 MM HEIGHT, SMT, 8 PIN |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 616K |
| 代理商： | AMMP-6233-BLKG |
Package, Tape & Reel, and Ordering Information
Back View
.011
Manual Assembly
FollowESDprecautionswhilehandlingpackages.
Handlingshouldbealongtheedgeswithtweezers.
Recommended attachment is conductive solder
paste.Pleaseseerecommendedsolderreflowprofile.
NeitherConductiveepoxyorhandsolderingisrecom-
mended.
Applysolderpasteusingastencilprinterordotplace-
ment.Thevolumeofsolderpastewillbedependenton
PCBandcomponentlayoutandshouldbecontrolled
toensureconsistentmechanicalandelectricalperfor-
mance.
Followsolderpasteandvendor’srecommendations
whendevelopingasolderreflowprofile.Astandard
profile will have a steady ramp up from room tem-
peraturetothepre-heattemp.toavoiddamagedue
tothermalshock.
Packages have been qualified to withstand a peak
temperatureof260°Cfor20seconds.Verifythatthe
profilewillnotexposedevicebeyondtheselimits.
Aproperlydesignedsolderscreenorstencilisrequired
toensureoptimumamountofsolderpasteisdeposited
ontothePCBpads.Therecommendedstencillayoutis
showninFigure16.Thestencilhasasolderpastede-
positionopeningapproximately70%to90%ofthePCB
pad. Reducing stencil opening can potentially gener-
atemorevoidsunderneath.Ontheotherhand,stencil
openingslargerthan100%willleadtoexcessivesolder
pastesmearorbridgingacrosstheI/Opads.Considering
thefactthatsolderpastethicknesswilldirectlyaffectthe
qualityofthesolderjoint,agoodchoiceistousealaser
cutstencilcomposedof0.127mm(5mils)thickstainless
steel which is capable of producing the required fine
stenciloutline.
Themostcommonlyusedsolderreflowmethodisac-
complished in a belt furnace using convection heat
transfer. The suggested reflow profile for automated
reflow processes is shown in Figure 17. This profile is
designed to ensure reliable finished joints. However,
theprofileindicatedinFigure1willvaryamongdifferent
solderpastesfromdifferentmanufacturersandisshown
hereforreferenceonly.
Figure 17. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temp(C)
Peak=250±5C
Ramp1
Preheat Ramp2 Reflow
Cooling
Meltingpoint=218C
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6233-TR1G | 功能描述:射頻放大器 LNA MMIC 18-31GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6233-TR2G | 功能描述:射頻放大器 LNA MMIC 18-31GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6333 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:18 a?? 33 GHz, 0.2 W Driver Amplifier in SMT Package |
| AMMP-6333-BLKG | 功能描述:射頻放大器 Dvr Amp 17-33GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6333-TR1G | 功能描述:射頻放大器 Dvr Amp 17-33GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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