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參數(shù)資料
| 型號： | AMMP-6220-TR1 |
| 廠商： | AGILENT TECHNOLOGIES INC |
| 元件分類： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | SMT, 8 PIN |
| 文件頁數(shù)： | 8/10頁 |
| 文件大?。?/td> | 382K |
| 代理商： | AMMP-6220-TR1 |
7
Outline Drawing
Recommended SMT Attachment
The AMMP Packaged Devices are
compatible with high volume
surface mount PCB assembly
processes.
The PCB material and mounting
pattern, as defined in the data
sheet, optimizes RF performance
and is strongly recommended.
An electronic drawing of the land
pattern is available upon request
from Agilent Sales & Application
Engineering.
Manual Assembly
1. Follow ESD precautions while
handling packages.
2. Handling should be along the
edges with tweezers.
3. Recommended attachment is
conductive solder paste.
Please see recommended sol-
der reflow profile. Conductive
epoxy is not recommended.
Hand soldering is not recom-
mended.
4. Apply solder paste using a
stencil printer or dot place-
ment. The volume of solder
paste will be dependent on
PCB and component layout
and should be controlled to
ensure consistent mechanical
and electrical performance.
5. Follow solder paste and
vendor’s recommendations
when developing a solder
reflow profile. A standard
profile will have a steady ramp
up from room temperature to
the pre-heat temperature to
avoid damage due to thermal
shock.
6. Packages have been qualified to
withstand a peak temperature
of 260
°C for 20 seconds. Verify
that the profile will not expose
device beyond these limits.
Suggested PCB Material and Land Pattern
Figure 22. Outline Drawing.
Figure 23.
3
2
1
4
8
BACK VIEW
0.012 (0.30)
0.016 (0.40)
0.014 (0.365)
0.011 (0.28)
0.018 (0.46)
0.114 (2.90)
0.100 (2.54)
0.059
(1.5)
0.126
(3.2)
0.029 (0.75)
56
7
0.016 (0.40)
0.93 (2.36)
0.028 (0.70)
NOTES:
1. * INDICATES PIN 1
2. DIMENSIONS ARE IN INCHES (MILLIMETERS)
3. ALL GROUNDS MUST BE SOLDERED TO PCB RF GROUND
DIMENSIONAL TOLERANCES: 0.002" (0.05 mm)
1
2
3
7
6
5
4
8
0.075 (1.91)
0.200 (5.08)
0.200
(5.08)
AMMP
XXXX
YWWDNN
FRONT VIEW
SIDE VIEW
*
0.010
(0.25)
0.093
(2.36)
0.011 (0.28)
0.016(0.40)
0.0095 (0.24)
0.012 (0.30)
0.016 (0.40)
GROUND VIAS SHOULD
BE SOLDER FILLED
0.020 (0.50)
0.059 (1.50)
0.126 (3.20)
INCHES (MILLIMETERS).
MATERIAL IS ROGERS RO4350, 0.010-INCH THICK.
0.018 (0.46)
0.0095 (0.24)
0.114 (2.90)
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| AMMP-6220-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6220-TR2 | 功能描述:射頻放大器 LNA MMIC 6-18 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6222 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:7 to 21 GHz GaAs High Linearity LNA in SMT Package |
| AMMP-6222-BLKG | 功能描述:射頻放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6222-TR1G | 功能描述:射頻放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6222-TR2G | 功能描述:射頻放大器 18-32GHz Hi-Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
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