- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄92919 > AMMP-6220-BLK (AGILENT TECHNOLOGIES INC) 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號： | AMMP-6220-BLK |
| 廠商： | AGILENT TECHNOLOGIES INC |
| 元件分類： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | SMT, 8 PIN |
| 文件頁數(shù)： | 9/10頁 |
| 文件大?。?/td> | 382K |
| 代理商： | AMMP-6220-BLK |
8
Solder Reflow Profile
The most commonly used solder
reflow method is accomplished in
a belt furnace using convection
heat transfer. The suggested
reflow profile for automated
reflow processes is shown in
Figure 25. This profile is designed
to ensure reliable finished joints.
However, the profile indicated in
Figure 25 will vary among differ-
ent solder pastes from different
manufacturers and is shown here
for reference only.
Figure 24. Suggested lead-free reflow profile for SnAgCu solder paste.
Figure 25. Stencil outline drawing (mm).
Stencil Design Guidelines
A properly designed solder screen
or stencil is required to ensure
optimum amount of solder paste
is deposited onto the PCB pads.
The recommended stencil layout
is shown in Figure 26. The stencil
has a solder paste deposition
opening approximately 70% to
90% of the PCB pad. Reducing
stencil opening can potentially
generate more voids underneath.
On the other hand, stencil open-
ings larger than 100% will lead to
excessive solder paste smear or
bridging across the I/O pads.
Considering the fact that solder
paste thickness will directly affect
the quality of the solder joint, a
good choice is to use a laser cut
stencil composed of 0.127 mm
(5 mils) thick stainless steel which
is capable of producing the re-
quired fine stencil outline. The
combined PCB and stencil layout
is shown in Figure 27.
Figure 26. Combined PCB and stencil layouts (mm).
TIME (SECONDS)
300
250
200
150
100
50
0
50
100
150
200
250
300
0
TEMPERA
TURE
(°
C)
PEAK = 250
± 5°C
MELTING POINT = 218
°C
RAMP 1
RAMP 2
REFLOW
COOLING
PREHEAT
0.60
1.80
3.20
0.67
0.36
0.40
0.27
0.30
2.90
1.60
STENCIL
OPENING
0.36
0.40
0.46
0.60
0.95
0.40
0.36
4x – R0.14
1.60
0.70
0.9550
1.80
0.27
0.36
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMP-6220-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-TR2 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-BLK | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-TR2 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-6220-TR1 | 功能描述:射頻放大器 LNA MMIC 6-18 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6220-TR2 | 功能描述:射頻放大器 LNA MMIC 6-18 GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6222 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:7 to 21 GHz GaAs High Linearity LNA in SMT Package |
| AMMP-6222-BLKG | 功能描述:射頻放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-6222-TR1G | 功能描述:射頻放大器 7-21GHz High Lin LNA RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。