- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄92919 > AMMP-5618-BLK (AGILENT TECHNOLOGIES INC) 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號： | AMMP-5618-BLK |
| 廠商： | AGILENT TECHNOLOGIES INC |
| 元件分類： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | SMT, 8 PIN |
| 文件頁數(shù)： | 8/9頁 |
| 文件大?。?/td> | 241K |
| 代理商： | AMMP-5618-BLK |
8
Figure 24. Suggested Lead-Free Reflow Profile for SnAgCu Solder Paste.
Figure 25. Stencil Outline Drawing (mm).
Figure 26. Combined PCB and Stencil Layouts (mm).
Solder Reflow Profile
The most commonly used solder
reflow method is accomplished in
a belt furnace using convection
heat transfer. The suggested
reflow profile for automated
reflow processes is shown in
Figure 24. This profile is designed
to ensure reliable finished joints.
However, the profile indicated in
Figure 1 will vary among differ-
ent solder pastes from different
manufacturers and is shown here
for reference only.
Stencil Design Guidelines
A properly designed solder
screen or stencil is required to
ensure optimum amount of solder
paste is deposited onto the PCB
pads. The recommended stencil
layout is shown in Figure 25. The
stencil has a solder paste deposi-
tion opening approximately 70%
to 90% of the PCB pad. Reducing
stencil opening can potentially
generate more voids underneath.
On the other hand, stencil
openings larger than 100% will
lead to excessive solder paste
smear or bridging across the I/O
pads. Considering the fact that
solder paste thickness will
directly affect the quality of the
solder joint, a good choice is to
use a laser cut stencil composed
of 0.127 mm (5 mils) thick
stainless steel which is capable of
producing the required fine
stencil outline.
The combined PCB and stencil
layout is shown in Figure 26.
0
50
100
150
200
250
300
0
50
100
150
200
250
300
Seconds
Temp
(°
C)
Ramp 1
Preheat
Ramp 2
Reflow
Cooling
Peak = 250
± 5°C
Melting point = 218
°C
0.36
0.40
0.70
0.27
0.36
4x - R0.14
0.95
0.36
0.60
1.60
0.9550
1.80
3.20 1.80 0.40
0.36
2.90
1.60
Stencil
Opening
0.30
0.27
0.40
0.36
0.46
0.40
0.60
0.67
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMP-5618-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-5618-TR2 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-5618 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-BLK | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMP-6220-TR1 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMP-5618-TR1 | 功能描述:射頻放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-5618-TR2 | 功能描述:射頻放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMP-5620 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620_13 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:6 a?? 20 GHz High Gain Amplifier in SMT Package |
| AMMP-5620-BLKG | 功能描述:射頻放大器 P-Amp 6-20GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。