- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄92919 > AMMC-6442-W10 37000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號： | AMMC-6442-W10 |
| 元件分類： | 放大器 |
| 英文描述： | 37000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | DIE |
| 文件頁數(shù)： | 7/8頁 |
| 文件大?。?/td> | 274K |
| 代理商： | AMMC-6442-W10 |
7
Recommended
Assembly Techniques
The chip should be attached directly to the ground plane
using electrically conductive epoxy (Note 1). For conduc-
tive epoxy, the amount should be just enough to provide
a thin llet around the bottom perimeter of the die. The
ground plane should be free of any residue that may
jeopardize electrical or mechanical attachment. Caution
should be taken to not exceed the Absolute Maximum
Rating for assembly temperature and time.
Thermo-sonic wedge bonding is the preferred method
for wire attachment to the bond pads. To optimize perfor-
mance for this device, the RF connections should be kept
at approximately 9mils in length using 1mil gold bond
wire. The recommended wire bonding stage temperature
is 150±2C.
Figure 15. Die dimensions
0
96
300
260
550
580
800
Vd3
GND
Vg2
Vg3
Vd1
GND
Vd2
Vd3
Vg1
1800
1000
2650
2000
2070
2650
1000
2000
2070
1075
1800
RF_IN
RF_OUT
The chip is 100
Pm thick and should be handled with care.
This chip has exposed air bridges on the top surface.
Handle at the edges or with a custom collet, (do not pick
up die with vacuum on die center).
This MMIC is static sensitive and ESD handling precau-
tions should be taken.
For more detailed information, see Avago Application
Note 54 “GaAs MMIC ESD, Die Attach and Bonding Guide-
lines.”
Notes:
1. Sumitomo 1295SA silver epoxy is recommended.
2. Eutectic attach is not recommended any may jeopardize reliability of
the device
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMC-6442-W50 | 37000 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| AMMC-6545-W10 | 18000 MHz - 45000 MHz RF/MICROWAVE SINGLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| AMMC-6545-W50 | 18000 MHz - 45000 MHz RF/MICROWAVE SINGLE BALANCED MIXER, 12 dB CONVERSION LOSS-MAX |
| AMMC-6550-W50 | 15000 MHz - 50000 MHz RF/MICROWAVE TRIPLE BALANCED MIXER, 10 dB CONVERSION LOSS-MAX |
| AMMP-5024 | 0.1 MHz - 40000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMC-6442-W50 | 功能描述:射頻放大器 Amp MMIC 35-40GHz Linear Power Amp RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點:37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-6522-W50 | 制造商:Avago Technologies 功能描述:LNA IR MIXER 6-22GHZ - Gel-pak, waffle pack, wafer, diced wafer on film |
| AMMC-6530-W10 | 功能描述:射頻混合器 Mixer MMIC 6-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMC-6530-W50 | 功能描述:射頻混合器 Mixer MMIC 6-30GHz RoHS:否 制造商:NXP Semiconductors 頻率范圍: 轉(zhuǎn)換損失——最大: 工作電源電壓:6 V 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:Through Hole 封裝 / 箱體:PDIP-8 封裝:Tube |
| AMMC-6545 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:18 to 45 GHz Sub - Harmonic Mixer LO Frequency: 9-24GHz |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。