- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄92919 > AMMC-6220-W50 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER PDF資料下載
參數(shù)資料
| 型號(hào)： | AMMC-6220-W50 |
| 元件分類： | 放大器 |
| 英文描述： | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| 封裝： | 0.067 X 0.031 INCH, 0.004 INCH HEIGHT, DIE |
| 文件頁(yè)數(shù)： | 7/8頁(yè) |
| 文件大?。?/td> | 521K |
| 代理商： | AMMC-6220-W50 |
Biasing and Operation
TheAMMC-6220isnormallybiasedwithasinglepositive
drainsupplyconnectedtobothVD1andVD2bondpads
throughthe2bypasscapacitorsasshowninFigure20.
Therecommendedsupplyvoltageis3V.Itisimportant
tohave2separate100pFbypasscapacitors,andthese
twocapacitorsshouldbeplacedasclosetothedieas
possible.
TheAMMC-6220doesnotrequireanegativegatevolt-
agetobiasanyofthethreestages.Nogroundwiresare
neededbecauseallgroundconnectionsaremadewith
platedthrough-holestothebacksideofthedevice.
RefertheAbsoluteMaximumRatingstableforallowed
DCandthermalconditions
Assembly Techniques
The backside of the MMIC chip is RF ground. For mi-
crostripapplicationsthechipshouldbeattacheddirectly
tothegroundplane(e.g.circuitcarrierorheatsink)using
electricallyconductiveepoxy[1,2]
Forbestperformance,thetopsideoftheMMICshould
be brought up to the same height as the circuit sur-
rounding it.This can be accomplished by mounting a
gold plate metal shim (same length and width as the
MMIC) under the chip which is of correct thickness to
make the chip and adjacent circuit the same height.
The amount of epoxy used for the chip and/or shim
attachment should be just enough to provide a thin
filletaroundthebottomperimeterofthechiporshim.
Thegroundplanshouldbefreeofanyresiduethatmay
jeopardizeelectricalormechanicalattachment.
Figure 19. AMMC-6220 Schematic
In
Vcc
Out
The location of the RF bond pads is shown in Figure
12.NotethatalltheRFinputandoutputportsareina
Ground-Signal-Groundconfiguration.
RF connections should be kept as short as reasonable
to minimize performance degradation due to undesir-
able series inductance. A single bond wire is normally
sufficientforsignalconnections,howeverdoublebond-
ingwith0.7milgoldwireoruseofgoldmeshisrecom-
mendedforbestperformance,especiallynearthehigh
endofthefrequencyband.
Thermosonic wedge bonding is preferred method for
wire attachment to the bond pads. Gold mesh can be
attached using a 2 mil round tracking tool and a tool
forceofapproximately22gramsandaultrasonicpower
ofroughly55dBforadurationof76±8mS.Theguided
wedge at an untrasonic power level of 64 dB can be
used for 0.7 mil wire. The recommended wire bond
stagetemperatureis150±2°C.
Caution should be taken to not exceed the Absolute
MaximumRatingforassemblytemperatureandtime.
The chip is 100um thick and should be handled with
care. This MMIC has exposed air bridges on the top
surfaceandshouldbehandledbytheedgesorwitha
customcollet(donotpickupthediewithavacuumon
diecenter).
This MMIC is also static sensitive and ESD precautions
shouldbetaken.
Notes:
1. Ablebond84-1LM1silverepoxyisrecommended.
2. Eutecticattachisnotrecommendedandmayjeopardizereliability
ofthedevice.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AMMC-6220 | 6000 MHz - 20000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMC-6231-W10 | 16000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMC-6231-W50 | 16000 MHz - 32000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMC-6241-W10 | 26000 MHz - 43000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
| AMMC-6241-W50 | 26000 MHz - 43000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AMMC-6222 | 制造商:AVAGO 制造商全稱:AVAGO TECHNOLOGIES LIMITED 功能描述:7 to 21 GHz GaAs High Linearity Low Noise Amplifier |
| AMMC-6222-W10 | 功能描述:射頻放大器 LNA 7-21GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-6222-W50 | 功能描述:射頻放大器 LNA 7-21GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
| AMMC-6231 | 制造商:HP 制造商全稱:Agilent(Hewlett-Packard) 功能描述:16-32 GHz Low Noise Amplifier |
| AMMC-6231-W10 | 功能描述:射頻放大器 LNA MMIC 18-31GHz RoHS:否 制造商:Skyworks Solutions, Inc. 類型:Low Noise Amplifier 工作頻率:2.3 GHz to 2.8 GHz P1dB:18.5 dBm 輸出截獲點(diǎn):37.5 dBm 功率增益類型:32 dB 噪聲系數(shù):0.85 dB 工作電源電壓:5 V 電源電流:125 mA 測(cè)試頻率:2.6 GHz 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-16 封裝:Reel |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。