參數(shù)資料
型號: AMC7584-ADJ
廠商: Electronic Theatre Controls, Inc.
元件分類: 基準(zhǔn)電壓源/電流源
英文描述: Cap-Free, NMOS, 150mA Low Dropout Regulator with Reverse Current Protection
中文描述: 無電容,NMOS管,150mA的低壓差穩(wěn)壓器的反向電流保護(hù)
文件頁數(shù): 5/7頁
文件大小: 344K
代理商: AMC7584-ADJ
AMC DOC. #: AMC7584_E (LF)
Feb 2005
APPLICATION INFORMATION:
AMC7584
7A L
OW
D
ROPOUT
R
EGULATOR
Copyright
2002, ADD Microtech Corp.
5
www.addmtek.com
z
Thermal Consideration
Maximum Power Calculation:
T
J(MAX)
– T
A(MAX)
θ
JA
O
C): Maximum recommended junction temperature
O
C): Ambient temperature of the application
P
D(MAX)
=
T
J
(
T
A
(
O
C/W): Junction-to-junction temperature thermal resistance of the package, and other heat dissipating
materials.
The maximum power dissipation of a single-output regulator
:
P
D(MAX)
=
[
(V
IN(MAX)
- V
OUT(NOM)
)
]
×
I
OUT(NOM)
+ V
IN(MAX)
×
I
Q
θ
JA
(
Where: V
OUT(NOM)
= the nominal output voltage
I
OUT(NOM)
= the nominal output current, and
I
Q
=
the quiescent current the regulator consumes at I
OUT(MAX)
V
IN(MAX)
= the maximum input voltage
Then
θ
JA
= (150
O
C – T
A
) / P
D
Thermal consideration:
When power consumption is over about 1.2W( at 70
o
C ambient temperature), additional heat sink is required to control the
junction temperature below 125
C.
The junction temperature is: Tj
= P
D
(
θ
JT
+
θ
CS
+
θ
SA
) + T
A
P
D
:
Dissipated power.
θ
JT
:
Thermal resistance from the junction to the mounting tab of the package.
θ
CS
:
Thermal resistance through the interface between the IC and the surface on which it is mounted. (typically,
θ
CS
< 1.0°C / W)
θ
SA
:
Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through hole vias.
PCB
θ
SA
(°C / W )
59
45
38
PCB heat sink size (mm
2
) 500
1000
1500
Recommended figure of PCB area used as a heat sink.
(Bottom View)
33
2000
27
3000
24
4000
21
5000
through hole vias
(Top View)
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