參數(shù)資料
型號(hào): AM80A-048L-050P25
元件分類(lèi): 電源模塊
英文描述: 1-OUTPUT 125 W DC-DC REG PWR SUPPLY MODULE
文件頁(yè)數(shù): 24/32頁(yè)
文件大小: 372K
代理商: AM80A-048L-050P25
AM80A
P
er
formance
S
er
ies
Rev. 05 Mar 99
AMPSS Reference Manual
30
Heatsink Mounting Information
Heatsinks for AMPSSTM modules are available in a
variety of sizes and fin orientation. Mounting kits and
thermal pads are also available. The table below
shows the options available for AM80A Performance
Series.
A heatsink mounting kit provides the most convenient
way to mount the heatsink to the module and then
mount the assembly onto a circuit board
AMPSSTM modules may be retained by their input and
output pins only, or may be fixed to the board using
bolts screwed into the tapped studs which are
provided as part of the mounting kit. In both cases
the studs provide clearance between the module and
the circuit board to facilitate PCB cleaning operations.
Note: baseplate and heatsink must be connected to
protective earth
1
2
Description
Model Number
Dimensions
Free air thermal
inches
mm
resistance
Heatsink, "80" size, vertical fin.
APA501-80-001
4.53x2.32x0.6
115x59x15
2.7°C/W
Heatsink, "80" size, horizontal fin
APA501-80-002
4.53x2.32x0.6
115x59x15
2.4°C/W
Heatsink, "80" size, vertical fin.
APA501-80-003
4.53x2.32x0.9
115x59x22.5
2.2°C/W
Heatsink, "80" size, horizontal fin
APA501-80-004
4.53x2.32x0.9
115x59x22.5
2.0°C/W
Heatsink, "80" size, vertical fin.
APA501-80-005
4.53x2.32x1.5
115x59x37
2.0°C/W
Heatsink, "80" size, horizontal fin
APA501-80-006
4.53x2.32x1.5
115x59x37
1.7°C/W
Heatsink, "80" size, low profile
APA501-80-007
4.55x3.50x0.5
115.6x89x12
2.2°C/W
Thermal Pad, "80" size
APA502-80-001
Mounting Kit, Tapped Studs
APA503-00-001
Mounting Kit, Solder Studs
APA503-00-002
Mounting Kit, Tapped Studs
APA503-00-007
for low profile heatsink
Mounting Kit, Solder Studs
APA503-00-008
for low profile heatsink
Spring Sockets (20 cont. 15pwr)
APA504-00-001
To provide optimal thermal contact between heatsink and module, it is recommended that the mating surface
of the heatsink should have a surface flatness of no greater than 0.1mm. The use of a thermal pad or thermal
grease is also recommended.
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