參數(shù)資料
型號: AM70PDL9BDH85IS
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
中文描述: 堆疊式多芯片封裝(MCP / XIP)的快閃記憶體,數(shù)據(jù)存儲的MirrorBit閃存和移動存儲芯片(XIP)的
文件頁數(shù): 15/128頁
文件大小: 916K
代理商: AM70PDL9BDH85IS
November 25, 2003
Am70PDL127BDH/Am70PDL129BDH
13
A D V A N C E I N F O R M A T I O N
MCP DEVICE BUS OPERATIONS
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory loca-
tion. The register is a latch used to store the com-
mands, along with the address and data information
needed to execute the command. The contents of the
register serve as inputs to the internal state machine.
The state machine outputs dictate the function of the
device. Tables 1-2 lists the device bus operations, the
inputs and control levels they require, and the resulting
output. The following subsections describe each of
these operations in further detail.
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AM70PDL9BDH85IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM70PDLI27BDH 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM71000 制造商:未知廠家 制造商全稱:未知廠家 功能描述:ASIC
AM7100N 制造商:ANALOGPOWER 制造商全稱:ANALOGPOWER 功能描述:N-Channel 100-V (D-S) MOSFET
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