參數資料
型號: AM70PDL7BDH85IT
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
中文描述: 堆疊式多芯片封裝(MCP / XIP)的快閃記憶體,數據存儲的MirrorBit閃存和移動存儲芯片(XIP)的
文件頁數: 13/128頁
文件大?。?/td> 916K
代理商: AM70PDL7BDH85IT
November 25, 2003
Am70PDL127BDH/Am70PDL129BDH
11
A D V A N C E I N F O R M A T I O N
PIN DESCRIPTION
A20–A0
= 21 Address Inputs (Common)
A21
= Address Input (Flash)
A22
= Address Input (PDL127 only)
(Flash)
DQ15–DQ0
= 16 Data Inputs/Outputs (Common)
CE#f1
= Chip Enable 1 (Flash)
CE#f2
= Chip Enable 2 (Flash)
(PDL129 Only)
CE#1ps
= Chip Enable 1 (pSRAM)
CE2ps
= Chip Enable 2 (pSRAM)
OE#
= Output Enable (Common)
WE#
= Write Enable (Common)
RY/BY#
= Ready/Busy Output and open drain.
When RY/BY# = V
IH
, the device is
ready to accept read operations and
commands. When RY/BY# = VOL,
the device is either executing an em-
bedded algorithm or the device is
executing a hardware reset opera-
tion.
UB#s
= Upper Byte Control (pSRAM)
LB#s
= Lower Byte Control (pSRAM)
RESET#
= Hardware Reset Pin, Active Low
WP#/ACC
= Write Protect/Acceleration Input.
When WP/ACC#= V
IL
, the highest
and lowest two 4K-word sectors are
write protected regardless of other
sector protection configurations.
When WP/ACC#= V
IH
, these sector
are unprotected unless the DYB or
PPB is programmed. When
WP/ACC#= 12V, program and erase
operations are accelerated.
V
CC
f
= Flash 3.0 volt-only single power sup-
ply (see Product Selector Guide for
speed options and voltage supply
tolerances)
V
CC
s
V
SS
ds
= pSRAM Power Supply
= Device Ground (Common)
= Data Storage
NC
= Pin Not Connected Internally
CE#1ds
= Chip Enable 1 (Am29LV640MH
Flash- Data Storage)
CE#2ds
= Chip Enable 2 (Am29LV640MH
Flash- Data Storage)
RY/BY#
= READY/BUSY Output (Data Stor-
age)
RESET#ds
= Hardware Reset Pin, Active Low
(Data Storage)
WP#/ACCds
= Write Protect/Acceleration Input
(Data Storage)
LOGIC SYMBOL
21
16
DQ15–DQ0
A20–A0
CE#f1
OE#
WE#
RESET#
UB#s
RY/BY#
WP#/ACC
A21
LB#s
CE#1ps
CE2ps
CE#f2 (PDL129 Only)
A22 (PDL127 Only)
CE#2ds
RESET#ds
CE#1ds
WP#/ACCds
RY/BY#ds
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AM70PDL9BDH66IS Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
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AM70PDL9BDH66IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM70PDL9BDH66IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM70PDL9BDH85IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM70PDL9BDH85IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM70PDLI27BDH 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)