參數(shù)資料
型號: AM70PDL7BDH66IS
廠商: Spansion Inc.
英文描述: Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
中文描述: 堆疊式多芯片封裝(MCP / XIP)的快閃記憶體,數(shù)據(jù)存儲的MirrorBit閃存和移動存儲芯片(XIP)的
文件頁數(shù): 124/128頁
文件大?。?/td> 916K
代理商: AM70PDL7BDH66IS
122
Am70PDL127BDH/Am70PDL129BDH
November 25, 2003
A D V A N C E I N F O R M A T I O N
PACKAGE PIN CAPACITANCE
Notes:
1.
Sampled, not 100% tested.
2.
Test conditions T
A
= 25°C, f = 1.0 MHz.
Parameter
Symbol
Parameter Description
Test Setup
Typ
Max
Unit
C
IN
Input Capacitance
V
IN
= 0
11
26
pF
C
OUT
Output Capacitance
V
OUT
= 0
12
28
pF
C
IN2
Control Pin Capacitance
V
IN
= 0
14
28
pF
C
IN3
WP#/ACC Pin Capacitance
V
IN
= 0
17
20
pF
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AM70PDL7BDH66IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM70PDL7BDH85IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM70PDL7BDH85IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM70PDL9BDH66IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)
AM70PDL9BDH66IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP/XIP) Flash Memory, Data storage MirrorBit Flash, and pSRAM (XIP)