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參數(shù)資料
| 型號： | AM49DL324BGB85 |
| 廠商： | Spansion Inc. |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| 中文描述： | 堆疊式多芯片封裝（MCP）閃存和SRAM的32兆位（4個M × 8位/ 2米x 16位），3.0伏的CMOS只，同時 |
| 文件頁數(shù)： | 45/64頁 |
| 文件大小： | 570K |
| 代理商： | AM49DL324BGB85 |
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44
Am49DL32xBG
July 19, 2002
P R E L I M I N A R Y
FLASH AC CHARACTERISTICS
Word/Byte Configuration (CIOf)
Parameter
Speed
JEDEC
Std
Description
70
85
Unit
t
ELFL/
t
ELFH
CE#f to CIOf Switching Low or High
Max
5
ns
t
FLQZ
CIOf Switching Low to Output HIGH Z
Max
30
ns
t
FHQV
CIOf Switching High to Output Active
Min
70
85
ns
DQ15
Output
Data Output
(DQ7
–
DQ0)
CE#f
OE#
CIOf
t
ELFL
DQ0
–
DQ14
Data Output
(DQ14
–
DQ0)
DQ15/A-1
Address
Input
t
FLQZ
CIOf
Switching
from word
to byte
mode
DQ15
Output
Data Output
(DQ7
–
DQ0)
CIOf
t
ELFH
DQ0
–
DQ14
Data Output
(DQ14
–
DQ0)
DQ15/A-1
Address
Input
t
FHQV
CIOf
Switching
from byte
to word
mode
Figure 16.
CIOf Timings for Read Operations
Note:
Refer to the Erase/Program Operations table for t
AS
and t
AH
specifications.
Figure 17.
CIOf Timings for Write Operations
CE#f
WE#
CIOf
The falling edge of the last WE# signal
t
HOLD
(t
AH
)
t
SET
(t
AS
)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AM49DL324BGT70 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL324BGT85 | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB70IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL32XBGB85IS | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM49DL324BGB85S | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL324BGB85T | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL324BGT70 | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous |
| AM49DL324BGT70S | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
| AM49DL324BGT70T | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory and 32 Mbit (2M x 16-Bit) |
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