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參數(shù)資料
| 型號： | AM45DL3208GT70IS |
| 廠商： | ADVANCED MICRO DEVICES INC |
| 元件分類： | 存儲器 |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA73 |
| 封裝： | 8 X 11.60 MM, FBGA-73 |
| 文件頁數(shù)： | 11/66頁 |
| 文件大?。?/td> | 1196K |
| 代理商： | AM45DL3208GT70IS |
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March 12, 2004
Am45DL3208G
9
P R E L I M I N A R Y
ORDERING INFORMATION
The order number (Valid Combination) is formed by the following:
Valid Combinations
Valid Combinations list configurations planned to be supported in vol-
ume for this device. Consult the local AMD sales office to confirm
availability of specific valid combinations and to check on newly re-
leased combinations.
MCP DEVICE BUS OPERATIONS
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory loca-
tion. The register is a latch used to store the com-
mands, along with the address and data information
needed to execute the command. The contents of the
register serve as inputs to the internal state machine.
The state machine outputs dictate the function of the
device. Tables
1
-
3
lists the device bus operations, the
inputs and control levels they require, and the resulting
output. The following subsections describe each of
these operations in further detail.
Am45DL320
8
G
T
70
I
T
TAPE AND REEL
T
=
S
=
7 inches
13 inches
TEMPERATURE RANGE
I
=
Industrial (–40
°
C to +85
°
C)
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT SECTOR
T
=
B
=
Top boot
Bottom boot
PROCESS TECHNOLOGY
G
=
0.17 μm
PSEUDO SRAM DEVICE DENSITY
8
=
8 Mbits
AMD DEVICE NUMBER/DESCRIPTION
Am45DL3208G
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
Am29DL320G 32 Megabit (8 M x 8-Bit/4 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation
Flash Memory and 8 Mbit (1 M x 8-Bit/512 K x 16-Bit) Pseudo Static RAM
Valid Combinations
Order Number
Package Marking
Am45DL3208GT70I
Am45DL3208GB70I
T, S
M450000008
M450000009
Am45DL3208GT85I
Am45DL3208GB85I
T, S
M45000000A
M45000000B
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| AM45DL3208GT70IT | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM45DL3208GT70IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT85IS | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL3208GT85IT | 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL32X8G | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Am45DL32x8G - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM45DL6408G | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:64 Mbit (8 M x 8-Bit/4 M x 16-Bit) CMOS and 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) (Preliminary) |
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