參數(shù)資料
型號(hào): AM42BDS640AGBC9IT
廠商: SPANSION LLC
元件分類: 存儲(chǔ)器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA93
封裝: 8 X 11.60 MM, FBGA-93
文件頁數(shù): 12/72頁
文件大?。?/td> 1060K
代理商: AM42BDS640AGBC9IT
November 1, 2002
Am42BDS640AG
11
P R E L I M I N A R Y
MCP DEVICE BUS OPERATIONS
This section describes the requirements and use of
the device bus operations, which are initiated through
the internal command register. The command register
itself does not occupy any addressable memory loca-
tion. The register is a latch used to store the
commands, along with the address and data informa-
tion needed to execute the command. The contents of
the register serve as inputs to the internal state ma-
chine. The state machine outputs dictate the function
of the device. Table 1 lists the device bus operations,
the inputs and control levels they require, and the re-
sulting output. The following subsections describe
each of these operations in further detail.
相關(guān)PDF資料
PDF描述
AM42BDS640AGTC8IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGTC8IT Circular Connector; No. of Contacts:13; Series:MS27468; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:11; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:11-35 RoHS Compliant: No
AM42BDS640AGTC9IS LJT 13C 13#22D PIN WALL RECP
AM42BDS640AGTC9IT LJT 13C 13#22D SKT RECP
AM42BDS640AGTD8IS Circular Connector; No. of Contacts:13; Series:MS27468; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:11; Circular Contact Gender:Socket; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:11-35 RoHS Compliant: No
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AM42BDS640AGBD9IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD9IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM