
A D V A N C E I N F O R M A T I O N
8
Am29SL800D
March 17, 2003
ORDERING INFORMATION
Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combi-
nation) is formed by a combination of the elements below.
Valid Combinations
Valid Combinations list configurations planned to be
supported in volume for this device. Consult the local AMD
sales office to confirm availability of specific valid
combinations and to check on newly released combinations.
Am29SL800D
T
-100
E
C
TEMPERATURE RANGE
C
=
Commercial (0°C to +70°C)
I
=
Industrial (–40
°
C to +85
°
C)
PACKAGE TYPE
E
=
48-Pin Thin Small Outline Package (TSOP)
Standard Pinout (TS 048)
48-Pin Thin Small Outline Package (TSOP)
Reverse Pinout (TSR048)
48-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 6 x 8 mm package (FBA048)
48-Ball Fine-Pitch Ball Grid Array (FBGA)
0.80 mm pitch, 8 x 9 mm package (FBC048)
F
=
WA
=
WC
=
SPEED OPTION
See Product Selector Guide and Valid Combinations
BOOT CODE SECTOR ARCHITECTURE
T
=
Top Sector
B
=
Bottom Sector
DEVICE NUMBER/DESCRIPTION
Am29SL800D
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS Flash Memory
1.8 Volt-only Read, Program, and Erase
Valid Combinations for TSOP Packages
AM29SL800DT90,
AM29SL800DB90
EC, EI, FC, FI
AM29SL800DT100,
AM29SL800DB100
AM29SL800DT120,
AM29SL800DB120
AM29SL800DT150,
AM29SL800DB150
Valid Combinations for FBGA Packages
Order Number
Package Marking
AM29SL800DT90,
AM29SL800DB90
WAC,
WAI
A800DT90U,
A800DB90U
C, I
WCC,
WCI
A800DT90P,
A800DB90P
AM29SL800DT100,
AM29SL800DB100
WAC,
WAI
A800DT10U,
A800DB10U
WCC,
WCI
A800DT10P,
A800DB10P
AM29SL800DT120,
AM29SL800DB120
WAC,
WAI
A800DT12U,
A800DB12U
WCC,
WCI
A800DT12P,
A800DB12P
AM29SL800DT150,
AM29SL800DB150
WAC,
WAI
A800DT15U,
A800DB15U
WCC,
WCI
A800DT15P,
A800DB15P