參數(shù)資料
型號(hào)： AM29LV642D
廠商： Advanced Micro Devices, Inc.
英文描述： 128 Megabit (8 M x 16-Bit) CMOS 3.0 Volt-only Uniform Sector Flash Memory with VersatileI/O Control
中文描述： 128兆位（8米× 16位）的CMOS 3.0伏特，只有統(tǒng)一閃存部門(mén)與VersatileI / O控制
文件頁(yè)數(shù)： 4/53頁(yè)
文件大小： 986K
代理商： AM29LV642D
Am29LV642D
3
P R E L I M I N A R Y
TABLE OF CONTENTS
Distinctive Characteristics . . . . . . . . . . . . . . . . . . 1
General Description . . . . . . . . . . . . . . . . . . . . . . . .2
Product Selector Guide . . . . . . . . . . . . . . . . . . . . . 4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Connection Diagram . . . . . . . . . . . . . . . . . . . . . . . . 6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . .9
Table 1. Am29LV642D Device Bus Operations ................................9
VersatileI/O
(V
IO
) Control ......................................................9
Requirements for Reading Array Data .....................................9
Writing Commands/Command Sequences ............................10
Accelerated ProgramOperation .............................................10
Autoselect Functions ..............................................................10
Standby Mode ........................................................................10
Automatic Sleep Mode ...........................................................10
RESET#: Hardware Reset Pin ...............................................10
Output Disable Mode ..............................................................11
Table 2. Sector Address Table for CE#..........................................11
Table 3. Sector Address Table for CE2#........................................15
Autoselect Mode .....................................................................19
Table 4. Am29LV642D Autoselect Codes, (HighVoltageMethod) 19
Sector Group Protection and Unprotection .............................20
Table 5. Sector Group Protection/Unprotection Address Table .....20
Temporary Sector Group Unprotect .......................................21
Figure 1. Temporary Sector Group UnprotectOperation................ 21
Figure 2. In-SystemSector Group Protect/UnprotectAlgorithms... 22
Hardware Data Protection ......................................................23
Low VCC Write Inhibit ............................................................23
Write Pulse “Glitch” Protection ...............................................23
Logical Inhibit ..........................................................................23
Power-Up Write Inhibit ............................................................23
Common Flash Memory Interface (CFI). . . . . . . 23
Table 6. CFI Query Identification String.......................................... 23
SystemInterface String................................................................... 24
Table 8. Device Geometry Definition.............................................. 24
Table 9. Primary Vendor-Specific Extended Query........................ 25
Command Definitions . . . . . . . . . . . . . . . . . . . . . 25
Reading Array Data ................................................................25
Reset Command .....................................................................26
Autoselect Command Sequence ............................................26
Word ProgramCommand Sequence .....................................26
Unlock Bypass Command Sequence .....................................26
Figure 3. ProgramOperation.......................................................... 27
Chip Erase Command Sequence ...........................................27
Sector Erase Command Sequence ........................................28
Erase Suspend/Erase Resume Commands ...........................28
Figure 4. Erase Operation............................................................... 29
Am29LV642D Command Definitions.............................................. 30
Write Operation Status . . . . . . . . . . . . . . . . . . . . .31
DQ7: Data#Polling .................................................................31
Figure 5. Data#Polling Algorithm.................................................. 31
RY/BY#: Ready/Busy#............................................................32
DQ6: Toggle Bit I ....................................................................32
Figure 6. Toggle Bit Algorithm........................................................ 32
DQ2: Toggle Bit II ...................................................................33
Reading Toggle Bits DQ6/DQ2 ...............................................33
DQ5: Exceeded Timng Limts ................................................33
DQ3: Sector Erase Timer .......................................................33
Table 11. Write Operation Status ...................................................34
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 35
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 35
Industrial (I) Devices .............................................35
Extended (E) Devices ...........................................35
V
CC
Supply Voltages ............................................35
Figure 7. MaximumNegative OvershootWaveform..................... 35
Figure 8. MaximumPositive OvershootWaveform....................... 35
DC Characteristics (for Two Am29LV640
devices) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 9. I
CC1
Current vs. Time (Showing Active and
AutomaticSleepCurrents)............................................................. 37
Figure 10. Typical I
vs. Frequency............................................ 37
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 38
Figure 11. Test Setup.................................................................... 38
Table 12. Test Specifications .........................................................38
Figure 12. Input Waveforms and MeasurementLevels................. 38
Key to Switching Waveforms. . . . . . . . . . . . . . . . 38
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 39
Read-Only Operations ...........................................................39
Figure 13. Read Operation Timngs............................................... 39
Hardware Reset (RESET#) ....................................................40
Figure 14. Reset Timngs............................................................... 40
Erase and ProgramOperations ..............................................41
Figure 15. ProgramOperation Timngs.......................................... 42
Figure 16. Accelerated ProgramTimng Diagram.......................... 42
Figure 17. Chip/Sector Erase Operation Timngs.......................... 43
Figure 18. Data# Polling Timngs (DuringEmbeddedAlgorithms). 44
Figure 19. Toggle Bit Timngs (DuringEmbeddedAlgorithms)...... 45
Figure 20. DQ2 vs. DQ6................................................................. 45
Temporary Sector Unprotect ..................................................46
Figure 21. Temporary Sector Group UnprotectTimngDiagram... 46
Figure 22. Sector Group Protect and UnprotectTimngDiagram.. 47
Figure 23. Alternate CE#Controlled Write
(Erase/Program OperationTimngs.............................................. 49
Erase And Programming Performance . . . . . . . 50
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 50
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 51
LSA064—64-Ball Fortified Ball Grid Array (Fortified BGA)
13 x 11 mmpackage ..............................................................51
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 52
Revision A (August 14, 2001) .................................................52
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