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參數(shù)資料
| 型號(hào)： | AM29F200BT-90DTH1 |
| 廠商： | ADVANCED MICRO DEVICES INC |
| 元件分類： | PROM |
| 英文描述： | 256K X 8 FLASH 5V PROM, 90 ns, UUC42 |
| 文件頁(yè)數(shù)： | 10/10頁(yè) |
| 文件大?。?/td> | 237K |
| 代理商： | AM29F200BT-90DTH1 |
10
Am29F200B Known Good Die
S U P P L E M E N T
REVISION SUMMARY
Revision C
Global
Formatted to match current template. Modified
Am29F200A data sheet for CS39S process technology.
Terms and Conditions
Replaced warranty with new version.
Revision D (December 1998)
Global
Added -75 speed option.
Ordering Information
Changed Gel-Pak quantity to 486. Corrected Surftape
reel size to 7 inches.
Packaging Information
Added section. Moved orientation information from die
photograph section into this section.
Revision D+1 (June 14, 1999)
Physical Specifications
Corrected bond pad dimensions and deleted Si from
the bond pad metalization specification.
Revision D+2 (July 12, 1999)
Global
The device is now available in the high temperature
range (–55
°
C to +140
°
C). T
J
(max) for this range is
+145
°
C.
Trademarks
Copyright 1999 Advanced Micro Devices, Inc. All rights reserved.
AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc.
Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AM29F200BT-90SC | 制造商:Advanced Micro Devices 功能描述: |
| AM29F200BT-90SI | 制造商:Spansion 功能描述:NOR Flash Parallel 5V 2Mbit 256K/128K x 8bit/16bit 90ns 44-Pin SO |
| AM29F200BT-90SI\\T | 制造商:Spansion 功能描述:AM29F200BT-90SI\\T - Tape and Reel |
| AM29F200BT-90SI\T | 制造商:Spansion 功能描述:AM29F200BT-90SI\T - Tape and Reel |
| AM29F400AB-120DGC1 | 制造商:Spansion 功能描述:4M FLASH KNOWN GOOD DIE W/ TOP BOOT (COMMERCIAL TEMP) - Gel-pak, waffle pack, wafer, diced wafer on film |
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