參數(shù)資料
型號(hào)： AM29F010B70JI
廠商： Spansion Inc.
英文描述： LCD Character display; No. of Digits/Alpha:32; Display Technology:LCD; Leaded Process Compatible:Yes; Peak Reflow Compatible (260 C):Yes RoHS Compliant: Yes
中文描述： 1兆位（128畝× 8位）的CMOS 5.0伏只，統(tǒng)一部門(mén)快閃記憶體
文件頁(yè)數(shù)： 4/35頁(yè)
文件大小： 849K
代理商： AM29F010B70JI
November 18, 2002
Am29F010B
3
TABLE OF CONTENTS
Product Selector Guide . . . . . . . . . . . . . . . . . . . . .4
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
Connection Diagrams . . . . . . . . . . . . . . . . . . . . . . .5
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . .7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Ordering Information . . . . . . . . . . . . . . . . . . . . . . .8
Device Bus Operations . . . . . . . . . . . . . . . . . . . . . .9
Table 1. Am29F010B Device Bus Operations .................................9
Requirements for Reading Array Data .....................................9
Writing Commands/Command Sequences ..............................9
Programand Erase Operation Status ....................................10
Standby Mode ........................................................................10
Output Disable Mode ..............................................................10
Table 2. Am29F010B Sector Addresses Table ...............................10
Autoselect Mode .....................................................................10
Table 3. Am29F010B Autoselect Codes (High Voltage Method) ....11
Sector Protection/Unprotection ...............................................11
Hardware Data Protection ......................................................11
Low V
CC
Write Inhibit ......................................................................11
Write Pulse “Glitch” Protection ........................................................11
Logical Inhibit ..................................................................................11
Power-Up Write Inhibit ....................................................................11
Command Definitions . . . . . . . . . . . . . . . . . . . . . .12
Reading Array Data ................................................................12
Reset Command .....................................................................12
Autoselect Command Sequence ............................................12
Byte ProgramCommand Sequence .......................................12
Figure 1. ProgramOperation ..........................................................13
Chip Erase Command Sequence ...........................................13
Sector Erase Command Sequence ........................................13
Erase Suspend/Erase Resume Commands ...........................14
Figure 2. Erase Operation ...............................................................14
Command Definitions .............................................................15
Table 4. Am29F010B Command Definitions ...................................15
Write Operation Status . . . . . . . . . . . . . . . . . . . . .16
DQ7: Data#Polling .................................................................16
Figure 3. Data#Polling Algorithm...................................................16
DQ6: Toggle Bit I ....................................................................16
Reading Toggle Bit DQ6 .........................................................17
Figure 4. Toggle Bit Algorithm.........................................................17
DQ5: Exceeded Timng Limts ................................................17
DQ3: Sector Erase Timer .......................................................18
Table 5. Write Operation Status .....................................................18
Absolute Maximum Ratings . . . . . . . . . . . . . . . . 19
Figure 5. MaximumNegative OvershootWaveform......................19
Figure 6. MaximumPositive OvershootWaveform........................19
Operating Ranges . . . . . . . . . . . . . . . . . . . . . . . . 19
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 20
Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 7. Test Setup .......................................................................22
Table 6. Test Specifications ...........................................................22
Key to Switching Waveforms . . . . . . . . . . . . . . . 22
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 8. Read Operations Timngs ...............................................23
Erase and ProgramOperations .........................................................24
Figure 9. ProgramOperation Timngs ............................................25
Figure 10. Chip/Sector Erase Operation Timngs ..........................25
Figure 11. Data#Polling Timngs (During Embedded Algorithms) .26
Figure 12. Toggle Bit Timngs (During Embedded Algorithms) ......26
Erase and ProgramOperations .........................................................27
Alternate CE#Controlled Writes ....................................................27
Figure 13. Alternate CE#Controlled Write Operation Timngs ......28
Erase and Programming Performance . . . . . . . 28
Latchup Characteristic . . . . . . . . . . . . . . . . . . . . 29
TSOP Pin Capacitance . . . . . . . . . . . . . . . . . . . . 29
PLCC and PDIP Pin Capacitance . . . . . . . . . . . . 29
Data Retention . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . 30
PD 032—32-Pin Plastic DIP ...................................................30
PL 032—32-Pin Plastic Leaded Chip Carrier .........................31
TS 032—32-Pin Standard Thin Small Outline Package .........32
TSR 032—32-Pin Standard Thin Small Outline Package .......33
Revision Summary . . . . . . . . . . . . . . . . . . . . . . . . 34
Revision A (August 12, 1999) .................................................34
Revision A+1 (September 22, 1999) ......................................34
Revision A+2 (September 27, 1999) ......................................34
Revision B (November 12, 1999) ............................................34
Revision C (November 28, 2000) ...........................................34
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM29F010B-70JI 功能描述:閃存 1M (128Kx8) 70ns 5v Parallel NOR 閃存 RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類(lèi)型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類(lèi)型: 接口類(lèi)型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
AM29F010B-70JI/T 制造商:Spansion 功能描述:FLASH PARALLEL 5V 1MBIT 128KX8 70NS 32PLCC - Tape and Reel
AM29F010B-70JI\T 功能描述:閃存 IC 5V 1M BIT FLSH SECTOR CS39S RoHS:否 制造商:ON Semiconductor 數(shù)據(jù)總線寬度:1 bit 存儲(chǔ)類(lèi)型:Flash 存儲(chǔ)容量:2 MB 結(jié)構(gòu):256 K x 8 定時(shí)類(lèi)型: 接口類(lèi)型:SPI 訪問(wèn)時(shí)間: 電源電壓-最大:3.6 V 電源電壓-最小:2.3 V 最大工作電流:15 mA 工作溫度:- 40 C to + 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體: 封裝:Reel
AM29F010B70PC 制造商:Advanced Micro Devices 功能描述:
AM29F010B-70PC 制造商:Advanced Micro Devices 功能描述:
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