參數(shù)資料
型號： AM29DL320GT50WMI
廠商： Advanced Micro Devices, Inc.
英文描述： 32 Megabit (4 M x 8-Bit/2 M x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory
中文描述： 32兆位（4個M × 8位/ 2米x 16位），3.0伏的CMOS只，同時作業(yè)快閃記憶體
文件頁數(shù)： 5/58頁
文件大?。?/td> 777K
代理商： AM29DL320GT50WMI
Am29DL320G
3
TABLE OF CONTENTS
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Special Package Handling Instructions ..........................................6
Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 1. Device Bus Operations .............................................................9
Word/Byte Configuration ................................................................9
Requirements for Reading Array Data ...........................................9
Writing Commands/Command Sequences ..................................10
Simultaneous Read/Write Operations
with ZeroLatency .........................................................................10
Standby Mode ..............................................................................10
Automatic Sleep Mode .................................................................10
RESET# Hardware Reset Pin .....................................................11
Output Disable Mode ...................................................................11
Table 2. Top Boot Sector Addresses ...................................................12
Table 3. Top Boot SecSi
TM
Sector Addresses..................................... 13
Table 4. BottomBoot Sector Addresses ...............................................14
Table 5. BottomBoot SecSi
TM
Sector Addresses................................ 15
Autoselect Mode ..........................................................................16
Table 6. Autoselect Codes, (High Voltage Method) .............................16
Sector/Sector Block Protection and Unprotection ........................17
Table 7. Top Boot Sector/Sector Block Addresses
forProtection/Unprotection ...................................................................17
Table 8. BottomBoot Sector/Sector Block Addresses
forProtection/Unprotection ...................................................................17
Write Protect (WP#) .....................................................................18
Temporary Sector Unprotect ........................................................18
Figure 1. Temporary Sector Unprotect Operation................................. 18
Figure 2. In-SystemSector Protection/
Sector Unprotection Algorithms............................................................ 19
SecSi
TM
(Secured Silicon) Sector
Flash MemoryRegion ..................................................................20
Figure 3. SecSi Sector Protect Verify.................................................... 21
Hardware Data Protection ............................................................21
Common Flash Memory Interface (CFI) . . . . . . . 21
Table 9. CFI Query Identification String................................................ 22
Table 10. SystemInterface String......................................................... 22
Table 11. Device Geometry Definition.................................................. 23
Table 12. Primary Vendor-Specific Extended Query............................ 23
Reading Array Data ......................................................................24
Reset Command ..........................................................................24
Autoselect Command Sequence ..................................................24
Enter SecSi
TM
Sector/Exit SecSi Sector
Command Sequence ...................................................................25
Byte/Word ProgramCommand Sequence ...................................25
Figure 4. ProgramOperation................................................................ 26
Chip Erase Command Sequence .................................................26
Sector Erase Command Sequence ..............................................26
Erase Suspend/Erase Resume Commands ................................27
Figure 5. Erase Operation.................................................................... 27
Table 13. Command Definitions........................................................... 28
DQ7: Data#Polling ......................................................................29
Figure 6. Data#Polling Algorithm......................................................... 29
RY/BY# Ready/Busy#.................................................................30
DQ6: Toggle Bit I ..........................................................................30
Figure 7. Toggle Bit Algorithm.............................................................. 30
DQ2: Toggle Bit II .........................................................................31
Reading Toggle Bits DQ6/DQ2 ....................................................31
DQ5: Exceeded Timng Limts ......................................................31
DQ3: Sector Erase Timer .............................................................31
Table 14. Write Operation Status .........................................................32
Figure 8. MaximumNegative OvershootWaveform............................. 33
Figure 9. MaximumPositive OvershootWaveform.............................. 33
Figure 10. I
Current vs. Time (Showing Active and
AutomaticSleepCurrents).................................................................... 35
Figure 11. Typical I
vs. Frequency................................................... 35
Figure 12. Test Setup.......................................................................... 36
Figure 13. Input Waveforms and Measurement Levels........................ 36
Figure 14. Read Operation Timngs...................................................... 37
Figure 15. Reset Timngs...................................................................... 38
Word/Byte Configuration (BYTE#) ...............................................39
Figure 16. BYTE#Timngs for Read Operations.................................. 39
Figure 17. BYTE#Timngs for Write Operations.................................. 39
Erase and ProgramOperations ...................................................40
Figure 18. ProgramOperation Timngs................................................ 41
Figure 19. Accelerated ProgramTimng Diagram................................ 41
Figure 20. Chip/Sector Erase Operation Timngs................................. 42
Figure 21. Back-to-back Read/Write Cycle Timngs............................. 43
Figure 22. Data#Polling Timngs (During EmbeddedAlgorithms)....... 43
Figure 23. Toggle Bit Timngs (During EmbeddedAlgorithms)............ 44
Figure 24. DQ2 vs. DQ6....................................................................... 44
Temporary Sector Unprotect ........................................................45
Figure 25. Temporary Sector Unprotect Timng Diagram..................... 45
Figure 26. Sector/Sector Block Protect and Unprotect TimngDiagram46
Alternate CE#Controlled Erase and ProgramOperations ...........47
Figure 27. Alternate CE#Controlled Write (Erase/Program)
OperationTimngs................................................................................ 48
Latchup Characteristics. . . . . . . . . . . . . . . . . . . . 49
TSOP And SO Pin Capacitance. . . . . . . . . . . . . . 49
Data Retention. . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
FBD063—63-ball Fine-Pitch Ball Grid Array (FBGA) 8x14mm.50
FBD048—Fine-Pitch Ball Grid Array, 6 x 12 mm.........................51
TS 048—Thin Small Outline Package ..........................................52
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