參數(shù)資料
型號(hào): AH315-G
廠商: TRIQUINT SEMICONDUCTOR INC
元件分類: 放大器
英文描述: 3300 MHz - 3800 MHz RF/MICROWAVE NARROW BAND HIGH POWER AMPLIFIER
封裝: 5 X 5 MM, GREEN, LEADLESS, PLASTIC, MO-220VHHC, SMT, QFN-24
文件頁數(shù): 8/9頁
文件大小: 339K
代理商: AH315-G
AH315
3.3 – 3.8 GHz WiMAX 2W Driver Amplifier
Mechanical Information
Package Information and Dimensions
Mounting Configuration
Notes:
1. All dimensions are in millimeters (inches). Angles
are in degrees
2.
Ground/Thermal vias are critical for the proper
performance of this device. Vias should be .35mm
(#80/.135”) diameter drill and have a final plated
thru diameter of .25mm (.010”).
3.
Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
4.
To ensure reliable operation, device ground paddle-
to-ground pad solder joint is critical
5.
Add mounting screws near the part to fasten board to
a heat sink. Ensure that the ground/thermal via
region contacts the heat sink
6.
Do not put solder mask on the backside of the PC
Board in the region where the board contacts the heat
sink.
7.
RF trace width depends upon the PC board
construction and material
8.
Use 1oz copper minimum
Lead-free/Green/RoHS-compliant.
Package pin plating - Annealed matte tin
over copper.
Compatible with lead-free (Tmax=260
°C)
and lead (Tmax=245
°C) soldering processes.
The AH315-G will be marked with an
“AH315G” designator on the top surface of
the package. An alphanumeric lot code
(“XXXX”) is also marked below the part
designator.
Data Sheet: Rev A 09/02/10
- 8 of 9 -
Disclaimer: Subject to change without notice
2010 TriQuint Semiconductor, Inc.
Connecting the Digital World to the Global Network
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