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參數(shù)資料
| 型號(hào)： | AH312-S8G |
| 元件分類： | 放大器 |
| 英文描述： | 400 MHz - 2300 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | GREEN, MS-012, SMT, SOIC-8 |
| 文件頁數(shù)： | 7/7頁 |
| 文件大?。?/td> | 357K |
| 代理商： | AH312-S8G |
Specifications and information are subject to change without notice.
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.TriQuint.com
Page 7 of 7 July 2008
AH312
2 Watt, High Linearity InGaP HBT Amplifier
AH312-S8G (Lead-Free Package) Mechanical Information
This package is lead-free/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free (maximum
260
°C reflow temperature) and lead (maximum 245 °C reflow temperature) soldering processes.
Outline Drawing
Mounting Configuration / Land Pattern
Product Marking
The component will be marked with an
“AH312G” designator with an alphanumeric lot
code on the top surface of the package.
The
obsoleted tin-lead version will have been marked
with an “AH312-S8” or “ECP200G” designator.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating:
Class 1B
Value:
Passes between 500 and 1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
MSL Rating: Level 2 at +260
°C convection reflows
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. A heatsink underneath the area of the PCB for the mounted device
is strictly required for proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
3. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
4. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8. All dimensions are in millimeters (inches). Angles are in degrees.
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| AK002D2-00 | 0.3 MHz - 2000 MHz RF/MICROWAVE VARIABLE ATTENUATOR, 2.5 dB INSERTION LOSS-MAX |
| AK002M1-12 | 0 MHz - 2500 MHz RF/MICROWAVE SGL POLE SGL THROW SWITCH, 1.2 dB INSERTION LOSS |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AH312-S8PCB1960 | 功能描述:射頻開發(fā)工具 1960MHz Eval Brd 11dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH312-S8PCB2140 | 功能描述:射頻開發(fā)工具 2140MHz Eval Brd 10dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH312-S8PCB900 | 功能描述:射頻開發(fā)工具 900MHz Eval Brd 18dB Gain RoHS:否 制造商:Taiyo Yuden 產(chǎn)品:Wireless Modules 類型:Wireless Audio 工具用于評估:WYSAAVDX7 頻率: 工作電源電壓:3.4 V to 5.5 V |
| AH312-S8TRG | 制造商:TriQuint Semiconductor 功能描述:RF & MW POWER AMPLIFIER |
| AH314 | 制造商:TriQuint Semiconductor 功能描述:RF & MW DRIVER AMPLIFIER |
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