參數(shù)資料
型號(hào): AH215-S8
廠商: Electronic Theatre Controls, Inc.
英文描述: 1 Watt, High Linearity HBT Amplifier
中文描述: 1瓦特,高線性異質(zhì)結(jié)雙極晶體管放大器
文件頁(yè)數(shù): 6/6頁(yè)
文件大小: 251K
代理商: AH215-S8
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
July 2004
AH215
1 Watt, High Gain HBT Amplifier
Product Information
The Communications Edge
TM
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
Notes:
1. The thermal resistance is referenced from the hottest part of
the junction to the ground slug underneath the device.
2. This corresponds to the typical biasing condition of +5V,
450 mA at an 85
°
C case temperature. A minimum MTTF
of 1 million hours is achieved for junction temperatures
below 247
°
C. Tjc is a function of the voltage at pins 6 & 7
and the current applied to pins 6, 7, and 8 and can be
calculated by:
Tjc = Tcase + Rth * Vcc * Icc
Rating
-40 to +85
°
C
33
°
C / W
159
°
C
Product Marking
The component will be marked with an
“AH215-S8” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
MSL Rating: Level 3 at +235
°
C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
1. A heatsink underneath the area of the PCB
for the mounted device is strictly required for
proper thermal operation. Damage to the
device can occur without the use of one.
2. Ground / thermal vias are critical for the
proper performance of this device. Vias
should use a .35mm (#80 / .0135”) diameter
drill and have a final plated thru diameter
of .25 mm (.010”).
3. Add as much copper as possible to inner and
outer layers near the part to ensure optimal
thermal performance.
4. Mounting screws can be added near the part
to fasten the board to a heatsink. Ensure that
the ground / thermal via region contacts the
heatsink.
5. Do not put solder mask on the backside of the
PC board in the region where the board
contacts the heatsink.
6. RF trace width depends upon the PC board
material and construction.
7. Use 1 oz. Copper minimum.
8 All dimensions are in millimeters (inches).
Angles are in degrees.
MTTF vs. GND Tab Temperature
100
1000
10000
100000
1000000
50
60
70
80
90
100
Tab temperature (° C)
M
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