
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 7 of 7 September 2005
AH201
Medium Power, High Linearity Amplifier
Product Information
The Communications Edge
TM
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85
° C
Thermal Resistance, Rth
(1)
17.5
° C / W
Junction Temperature, Tjc
(2)
152
° C
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85
° C.
2. This corresponds to the typical biasing condition of
+11V, 350 mA at an 85
° C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160
° C.
Product Marking
The component will be lasermarked with an
“AH201” product label with a five-digit
alphanumeric lot code on the top surface of
the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section
ESD / MSL Information
ESD Rating: Class 1B
Value:
Passes between 500 and 1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class III
Value:
Passes between 500 and 1000V
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 1 at +235
° C convection reflow
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1. Ground vias are critical for thermal and RF grounding
considerations.
2. Two 2-56 screws with washers should be used for thermal
grounding to the main chassis.
3. Ground plane on the backside should extend past the holes for
the 2-56 screws as a minimum.
4. No soldermask should be applied to the backside of the board
local to the part to ensure contact between the backside
metalization and chassis.
5. Via holes and holes for the 2-56 screws should be plated through.
6. Trace width depends on the PC board.
7. A minimum of 1 oz. / 1 oz. Copper should be used.
8. Pin 4 should not be connected for proper operation.
Functional Pin Layout
Pin
FUNCTION
1
GND
2
RF Input
3
GND
4
No Connect
(Do not ground)
5
GND
6
GND
7
GND
8
GND
9
RF Output / Bias
10
GND
.
MTTF vs. GND Tab Temperature
0
1
10
100
60
70
80
90
100
110
Tab Temperature (°C)