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參數(shù)資料
| 型號(hào)： | AH115-S8PCB1960 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | JT 128C 128#22D SKT RECP |
| 中文描述： | 1 / 2瓦特，高線性InGaP HBT功率放大器 |
| 文件頁(yè)數(shù)： | 7/7頁(yè) |
| 文件大?。?/td> | 577K |
| 代理商： | AH115-S8PCB1960 |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 7 of 7 May 2005
AH115 / ECP050G
Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
ECP050G (SOIC-8 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85 C. Tjc is a
function of the voltage at pins 6 and 7 and the current
applied to pins 6, 7, and 8 and can be calculated by:
Tjc = Tcase + Rth * Vcc * Icc
2. This corresponds to the typical biasing condition of
+5V, 250 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247 C.
Rating
-40 to +85
q
C
62
q
C / W
162
q
C
Product Marking
The component will be marked with an
“ECP050G” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
MSL Rating: Level 3 at +235 C convection reflow
Standard:
JEDEC Standard J-STD-020
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper performance of this
device. Vias should use a .35mm (#80 / .0135”) diameter drill and
have a final plated thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer layers near the
part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region contacts the
heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in degrees.
MTTF vs. GND Tab Temperature
100
1000
10000
100000
1000000
50
60
70
80
90
100
Tab Temperature (°C )
M
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