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參數(shù)資料
| 型號： | AH110-89PCB900 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:29; Series:MS27472; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:24; Circular Contact Gender:Socket; Circular Shell Style:Wall Mount Receptacle RoHS Compliant: No |
| 中文描述： | 0.2瓦，高線性InGaP HBT功率放大器 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大?。?/td> | 355K |
| 代理商： | AH110-89PCB900 |
.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6621
e-mail: sales@wj.com
Web site: www.wj.com
December 2004
AH110
0.2 Watt, High Linearity InGaP HBT Amplifier
Product Information
The Communications Edge
TM
AH110 (SOT-89 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
Notes:
1. The thermal resistance is referenced from the junction-
to-case at a case temperature of 85
2. This corresponds to the typical biasing condition of
+5V, 100 mA at an 85
minimum MTTF of 1 million hours is achieved for
junction temperatures below 247
Rating
-40 to +85
q
C
128
q
C / W
149
q
C
C.
C case temperature. A
C.
Product Marking
The component will be marked with an
“AH110” designator with an alphanumeric lot
code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1B
Value:
Test:
Standard:
MSL Rating: Level 3 at +235
Standard:
Passes between 500 and 1000V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
C convection reflow
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink. Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees
MTTF vs. GND Tab Temperature
100
1000
10000
100000
60
70
80
90
100
110
120
Tab Temperature (°C)
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
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| AH110-RFID | 制造商:WJCI 制造商全稱:WJCI 功能描述:0.2 Watt, High Linearity InGaP HBT Amplifier |
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| AH11109 | 制造商:Panasonic Electric Works 功能描述: |
| AH11-2 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Analog IC |
| AH114 | 制造商:WJCI 制造商全稱:WJCI 功能描述: Watt, High Linearity InGaP HBT Amplifier |
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