2-6 Revision 16 Thermal Characteristics Introduction The temperature variable in the Microsemi " />
參數(shù)資料
型號： AGLP030V2-VQG128
廠商： Microsemi SoC
文件頁數(shù)： 48/134頁
文件大小： 0K
描述： IC FPGA IGLOO PLUS 30K 128-VQFN
標(biāo)準(zhǔn)包裝： 90
系列： IGLOO PLUS
邏輯元件/單元數(shù)： 792
輸入/輸出數(shù)： 101
門數(shù)： 30000
電源電壓： 1.14 V ~ 1.575 V
安裝類型： 表面貼裝
工作溫度： 0°C ~ 70°C
封裝/外殼： 128-TQFP
供應(yīng)商設(shè)備封裝： 128-VTQFP（14x14）
IGLOO PLUS DC and Switching Characteristics
2-6
Revision 16
Thermal Characteristics
Introduction
The temperature variable in the Microsemi Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction temperature to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = T + TA
EQ 1
where:
TA = Ambient temperature
T = Temperature gradient between junction (silicon) and ambient T = ja * P
ja = Junction-to-ambient of the package. ja numbers are located in Figure 2-5.
P = Power dissipation
Package Thermal Characteristics
The device junction-to-case thermal resistivity is
jc and the junction-to-ambient air thermal resistivity is
ja. The thermal characteristics for ja are shown for two air flow rates. The maximum operating junction
temperature is 100°C. EQ 2 shows a sample calculation of the maximum operating power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Temperature and Voltage Derating Factors
Maximum Power Allowed
Max. junction temp. (
C) Max. ambient temp. (C)
–
ja(C/W)
------------------------------------------------------------------------------------------------------------------------------------------
100
C70C
–
20.5°C/W
-------------------------------------
1.46 W
=
Table 2-5 Package Thermal Resistivities
Package Type
Pin
Count
jc
ja
Units
Still Air
200 ft./
min.
500 ft./
min.
Chip Scale Package (CSP)
CS201
TBD
C/W
CS281
TBD
C/W
CS289
TBD
C/W
Very Thin Quad Flat Package (VQFP)
VQ128
TBD
C/W
VQ176
TBD
C/W
Table 2-6 Temperature and Voltage Derating Factors for Timing Delays (normalized to TJ = 70°C,
VCC = 1.425 V)
For IGLOO PLUS V2 or V5 devices, 1.5 V DC Core Supply Voltage
Array Voltage
VCC (V)
Junction Temperature (°C)
–40°C
0°C
25°C
70°C
85°C
100°C
1.425
0.934
0.953
0.971
1.000
1.007
1.013
1.5
0.855
0.874
0.891
0.917
0.924
0.929
1.575
0.799
0.816
0.832
0.857
0.864
0.868
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參數(shù)描述
AGLP030V2-VQG128I 功能描述:IC FPGA IGLOO PLUS 30K 128-VQFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場可編程門陣列） 系列:IGLOO PLUS 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14）
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