
June 2013
I
 2013 Microsemi Corporation
IGLOO nano Low Power Flash FPGAs
with Flash*Freeze Technology
Features and Benefits
Low Power
 nanoPower Consumption—Industry’s Lowest Power
 1.2 V to 1.5 V Core Voltage Support for Low Power
 Supports Single-Voltage System Operation
 Low Power Active FPGA Operation
 Flash*Freeze Technology Enables Ultra-Low Power
Consumption while Maintaining FPGA Content
 Easy Entry to / Exit from Ultra-Low Power Flash*Freeze Mode
Small Footprint Packages
 As Small as 3x3 mm in Size
Wide Range of Features
 10,000 to 250,000 System Gates
 Up to 36 kbits of True Dual-Port SRAM
 Up to 71 User I/Os
Reprogrammable Flash Technology
 130-nm, 7-Layer Metal, Flash-Based CMOS Process
 Instant On Level 0 Support
 Single-Chip Solution
 Retains Programmed Design When Powered Off
 250 MHz (1.5 V systems) and 160 MHz (1.2 V systems) System
Performance
In-System Programming (ISP) and Security
 ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption via JTAG (IEEE 1532–compliant)
 FlashLock Designed to Secure FPGA Contents
1.2 V Programming
High-Performance Routing Hierarchy
 Segmented, Hierarchical Routing and Clock Structure
Advanced I/Os
 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
 Bank-Selectable I/O Voltages—up to 4 Banks per Chip
 Single-Ended I/O Standards: LVTTL, LVCMOS
3.3V /2.5 V / 1.8V /1.5 V/1.2 V
 Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
 Wide Range Power Supply Voltage Support per JESD8-12,
Allowing I/Os to Operate from 1.14 V to 1.575 V
 I/O Registers on Input, Output, and Enable Paths
 Selectable Schmitt Trigger Inputs
 Hot-Swappable and Cold-Sparing I/Os
 Programmable Output Slew Rate and Drive Strength
 Weak Pull-Up/-Down
 IEEE 1149.1 (JTAG) Boundary Scan Test
 Pin-Compatible Packages across the IGLOO Family
Clock Conditioning Circuit (CCC) and PLL
 Up to Six CCC Blocks, One with an Integrated PLL
 Configurable Phase Shift, Multiply/Divide, Delay
Capabilities, and External Feedback
 Wide Input Frequency Range (1.5 MHz up to 250 MHz)
Embedded Memory
 1 kbit of FlashROM User Nonvolatile Memory
 SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organization
s) True Dual-Port SRAM (except × 18 organization
)Enhanced Commercial Temperature Range
 Tj = -20°C to +85°C
 AGLN030 and smaller devices do not support this feature.
IGLOO nano Devices
AGLN010 AGLN0151 AGLN020
AGLN060
AGLN125
AGLN250
IGLOO nano-Z Devices1
AGLN030Z1
AGLN060Z1 AGLN125Z1 AGLN250Z1
System Gates
10,000
15,000
20,000
30,000
60,000
125,000
250,000
Typical Equivalent Macrocells
86
128
172
256
512
1,024
2,048
VersaTiles (D-flip-flops)
260
384
520
768
1,536
3,072
6,144
Flash*Freeze Mode (typical, W)
2
4
5
10
16
24
RAM Kbits (1,024 bits)2
–
18
36
4,608-Bit Blocks2
––
–
4
8
FlashROM Kbits (1,024 bits)
1
Secure (AES) ISP2
––
–
Yes
Integrated PLL in CCCs 2,3
––
–
1
VersaNet Globals
4
6
18
I/O Banks
2
3
2
4
Maximum User I/Os (packaged device)
34
49
52
77
71
68
Maximum User I/Os (Known Good Die)
34
–
52
83
71
68
Package Pins
UC/CS
QFN
VQFP
UC36
QN48
QN68
UC81,
CS81
QN68
UC81, CS81
QN48, QN68
VQ100
CS81
VQ100
CS81
VQ100
CS81
VQ100
Notes:
1. Not recommended for new designs.
2. AGLN030 and smaller devices do not support this feature.
3. AGLN060, AGLN125, and AGLN250 in the CS81 package do not support PLLs.
4. For higher densities and support of additional features, refer to the IGLOO and IGLOOe datasheets. Revision 17