Revision 17 2-11 Table 2-17 Different Components Contributing to Dynamic Power Consumption in IGLOO nano " />
參數(shù)資料
型號: AGLN020V5-CSG81
廠商: Microsemi SoC
文件頁數(shù): 71/150頁
文件大?。?/td> 0K
描述: IC FPGA 20K 1.5V CSP81
標準包裝: 640
系列: IGLOO nano
邏輯元件/單元數(shù): 520
輸入/輸出數(shù): 52
門數(shù): 20000
電源電壓: 1.425 V ~ 1.575 V
安裝類型: 表面貼裝
工作溫度: -20°C ~ 70°C
封裝/外殼: 81-WFBGA,CSBGA
供應商設備封裝: 81-CSP(5x5)
其它名稱: 1100-1126
IGLOO nano Low Power Flash FPGAs
Revision 17
2-11
Table 2-17 Different Components Contributing to Dynamic Power Consumption in IGLOO nano Devices
For IGLOO nano V2 Devices, 1.2 V Core Supply Voltage
Parameter
Definition
Device-Specific Dynamic Power (W/MHz)
AGLN250 AGLN125 AGLN060 AGLN020 AGLN015 AGLN010
PAC1
Clock contribution of a Global Rib
2.829
2.875
1.728
0
PAC2
Clock contribution of a Global Spine
1.731
1.265
1.268
2.562
1.685
PAC3
Clock contribution of a VersaTile row
0.957
0.963
0.967
0.862
0.858
PAC4
Clock contribution of a VersaTile used
as a sequential module
0.098
0.094
0.091
PAC5
First contribution of a VersaTile used
as a sequential module
0.045
PAC6
Second contribution of a VersaTile
used as a sequential module
0.186
PAC7
Contribution of a VersaTile used as a
combinatorial module
0.11
PAC8
Average contribution of a routing net
0.45
PAC9
Contribution of an I/O input pin
(standard-dependent)
PAC10
Contribution of an I/O output pin
(standard-dependent)
PAC11
Average contribution of a RAM block
during a read operation
25.00
N/A
PAC12
Average contribution of a RAM block
during a write operation
30.00
N/A
PAC13
Dynamic contribution for PLL
2.10
N/A
Table 2-18 Different Components Contributing to the Static Power Consumption in IGLOO nano Devices
For IGLOO nano V2 Devices, 1.2 V Core Supply Voltage
Parameter
Definition
Device-Specific Static Power (mW)
AGLN250 AGLN125 AGLN060 AGLN020 AGLN015 AGLN010
PDC1
Array static power in Active mode
PDC2
Array static power in Static (Idle)
mode
PDC3
Array static power in Flash*Freeze
mode
PDC4 1
Static PLL contribution
0.90
N/A
PDC5
Bank quiescent power
(VCCI-dependent)2
Notes:
1. Minimum contribution of the PLL when running at lowest frequency.
2. For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi power spreadsheet
calculator or the SmartPower tool in Libero SoC.
相關PDF資料
PDF描述
GMM44DRTF-S13 CONN EDGECARD 88POS .156 EXTEND
ADM1023ARQ IC SENSOR TEMP PREC DUAL 16QSOP
AGLN010V2-QNG48 IC FPGA 10K 1.2-1.5V 48QFN
RYM43DRST CONN EDGECARD 86POS DIP .156 SLD
ADM1021ARQ-REEL7 IC SENSOR TEMP DUAL3/5.5V 16QSOP
相關代理商/技術參數(shù)
參數(shù)描述
AGLN020V5-CSG81I 功能描述:IC FPGA NANO 1KB 20K 81-CSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
AGLN020V5-QNG68 功能描述:IC FPGA 20K 1.5V 68QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:24 系列:ECP2 LAB/CLB數(shù):1500 邏輯元件/單元數(shù):12000 RAM 位總計:226304 輸入/輸出數(shù):131 門數(shù):- 電源電壓:1.14 V ~ 1.26 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:208-BFQFP 供應商設備封裝:208-PQFP(28x28)
AGLN020V5-QNG68I 功能描述:IC FPGA NANO 1KB 20K 68-QFN RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)
AGLN020V5-UCG81 功能描述:IC FPGA 20K 1.5V UCG81 RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:60 系列:XP LAB/CLB數(shù):- 邏輯元件/單元數(shù):10000 RAM 位總計:221184 輸入/輸出數(shù):244 門數(shù):- 電源電壓:1.71 V ~ 3.465 V 安裝類型:表面貼裝 工作溫度:0°C ~ 85°C 封裝/外殼:388-BBGA 供應商設備封裝:388-FPBGA(23x23) 其它名稱:220-1241
AGLN020V5-UCG81I 功能描述:IC FPGA NANO 1KB 20K 81-UCSP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現(xiàn)場可編程門陣列) 系列:IGLOO nano 標準包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計:- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA,CSBGA 供應商設備封裝:289-CSP(14x14)