
V2.4 Dec 2006
Data Sheet
Ag9000-S
Power-Over-Ethernet Module
7. Typical Recommendations
Figure 8: Typical Layout gives an example of the tracking needed for the Ag9000-S. R1,
R2 and R3 are optional components, but C1 needs to be positioned close to the output
pins of the Ag9000-S as possible to minimise the current loop. The thermal performance of
the Ag9000-S can be improved by increasing the surface area of the output tracks (+VDC
and GND) this is not applicable if the Ag9000-S is in a socket.
Output
Voltage
VA & VB
Inputs
R2
+
R1
R3
_
ADJ
CLASS
C1
Ag9000-S
1
*
*
* Heat dissipation of the Ag9000C-S can be improved by increasing the surface area of the +VDC and GND output tracks.
Figure 8: Typical Layout
8. Operating Temperature Range
Because the Ag9000-S is a power component, it will generate heat, so it is important that
this be taken into consideration at the design stage.
The heart of the Ag9000-S is a DC/DC converter, which like any other power supply will
generate heat. The amount of heat generated by the module will depend on the load it is
required to drive and the input voltage supplied by the PSE. The information shown within
this section of datasheet is referenced to a nominal 48Vdc input voltage supplied by the
PSE.
The Ag9000-S has a maximum ambient operating temperature of 70
O
C see Figure 10,
Figure 11 & Figure 12. These results are in still air without any heatsinking, the
performance of the Ag9000-S can be improved by forcing the airflow over the part or by
using a heatsink (see the Ag9000-S application note on heatsinking for more information).
The output stage of the Ag9000-S has a built-in thermal protection circuit, to prevent the
module from being damaged if operated beyond its power / temperature specification.
Because each application is different it is impossible to give fixed and absolute thermal
recommendations. However it is important that any enclosure used has sufficient
ventilation for the Ag9000-S and a direct airflow if possible.
Silver Telecom 2006
10