- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄379659 > AG606-PCB (Electronic Theatre Controls, Inc.) Push-Pull CATV Amplifier PDF資料下載
參數(shù)資料
| 型號： | AG606-PCB |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | Push-Pull CATV Amplifier |
| 中文描述： | 推挽式CATV放大器 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 503K |
| 代理商： | AG606-PCB |
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Specifications and information are subject to change without notice.
Page 6 of 6 July 2005
The Communications Edge
TM
Product Information
AG606
Push-Pull CATV Amplifier
AG606-G (Lead-Free Package) Mechanical Information
This package is lead-free/green/RoHS-compliant. The plating material on the leads is NiPdAu. It is compatible with both lead-free
(maximum 260
q
C reflow temperature) and lead (maximum 245
q
C reflow temperature) soldering processes.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
Rating
-40 to +85
q
C
63
q
C/W
142
q
C
Notes:
1. The thermal resistance is referenced from the hottest part
of the junction to ground tab underneath the device.
2. This corresponds to the typical biasing condition of
+5.16V, 175 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 C.
Product Marking
The component will be marked with an
“AG606G” designator with an alphanumeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
ESD / MSL Information
ESD Rating: Class 1C
Value:
Test:
Standard:
ESD Rating: Class IV
Value
Test:
Standard:
MSL Rating: Level 2 at +260 C convection reflow
Standard:
JEDEC Standard J-STD-020A
Mounting Config. Notes
1000 to 2000 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes greater than 1000 V
Charge Device Model (CDM)
JEDEC Standard JESD22-C101
1.
Ground / thermal vias are critical for the proper performance
of this device. Vias should use a .35mm (#80/.0135”)
diameter drill and have a final plated through diameter of
.25mm (.010”)
2. Add as much copper as possible to inner and outer layers
near the part to ensure optimal thermal performance.
3. To ensure reliable operation, device ground paddle-to-
ground pad solder joint is critical.
4.
Add mounting screws near the part to fasten the board to a
heatsink. Ensure that the ground / thermal via region
contacts the heatsink.
5. For optimal thermal performance, expose soldermask on
backside where it contacts the heatsink.
6. RF trace width depends upon the PC board material and
construction.
7. Use 1 oz. Copper minimum.
8.
If the PCB design rules allow, ground vias should be placed
under the land pattern for better RF and thermal
performance. Otherwise ground vias should be placed as
close to the land pattern as possible.
9.
All dimensions are in mm. Angles are in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
10000
50
60
70
80
90
100
Tab Temperature (°C)
M
相關PDF資料 |
PDF描述 |
|---|---|
| AG8000 | Power-Over-Ethernet Module |
| AG8100 | Power-Over-Ethernet Module |
| AG8200 | Power-Over-Ethernet Module |
| AG9000-S | Power-Over-Ethernet Module |
| AG9033-S | Power-Over-Ethernet Module |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| AG606-S8TRG | 制造商:TriQuint Semiconductor 功能描述:BROADBAND/CATV (75 OHM) MISC. AMPLIFIER |
| AG60P-5 | 功能描述:SINGLE O/P, DC-HV DC PCB MOUNT, 制造商:xp power 系列:XP EMCO - AG 包裝:盒 零件狀態(tài):有效 類型:高電壓 - 隔離模塊 輸出數(shù):1 電壓 - 輸入（最小值）:0.7V 電壓 - 輸入（最大值）:5V 電壓 - 輸出 1:6000V 電壓 - 輸出 2:- 電壓 - 輸出 3:- 電流 - 輸出（最大值）:1.67mA 功率（W） - 制造系列:1W 電壓 - 隔離:500V 應用:ITE（商業(yè)） 特性:SCP 安裝類型:表面貼裝 封裝/外殼:5-SMD 模塊 大小/尺寸:1.13" 長 x 0.45" 寬 x 0.25" 高（28.7mm x 11.4mm x 6.4mm） 工作溫度:-25°C ~ 75°C 效率:- 功率（W） - 最大值:1W 標準包裝:1 |
| AG611 | 制造商:CIF 功能描述:TINNER COPPER PADS 1 SIDE 100X160MM 制造商:CIF 功能描述:TINNER COPPER PADS 1 SIDE 100X160MM; Board Material:Epoxy; External Height:160mm; External Width:160mm; Board Connector / Footprint:DIN41612; SVHC:No SVHC (19-Dec-2012); External Length / Height:160mm; Material:Epoxy 16/10; PCB Hole ;RoHS Compliant: Yes |
| AG6124-SM | 制造商:Panasonic Industrial Company 功能描述:SERVICE MANUAL |
| AG6200-SM | 制造商:Panasonic Industrial Company 功能描述:SERVICE MANUAL |
發(fā)布緊急采購，3分鐘左右您將得到回復。