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參數(shù)資料
| 型號(hào)： | AG403-89G |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | InGaP HBT Gain Block |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數(shù)： | 5/6頁 |
| 文件大小： | 329K |
| 代理商： | AG403-89G |
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com
Page 5 of 6 March 2005
AG403-86
InGaP HBT Gain Block
Product Information
The Communications Edge
TM
AG403-86 (SOT-86 Package) Mechanical Information
This package may contain lead-bearing materials. The plating material on the leads is SnPb.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Operating Case Temperature
Thermal Resistance, Rth
(1)
Junction Temperature, Tjc
(2)
1. The thermal resistance is referenced from the hottest part
of the junction to the ground lead (pin 2 or 4).
2. This corresponds to the typical biasing condition of
+4.91V, 60 mA at an 85 C case temperature. A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 177 C.
Rating
-40 to +85
q
C
233
q
C/W
143
q
C
Product Marking
The component will be marked with a “G”
designator followed by a two-digit numeric
lot code on the top surface of the package.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 0
Value:
Test:
Standard:
ESD Rating: Class II
Value:
Test:
Standard:
MSL Rating: Level 1
Standard:
Mounting Config. Notes
Passes at 150 V
Human Body Model (HBM)
JEDEC Standard JESD22-A114
Passes at 250 V
Charged Device Model (CDM)
JEDEC Standard JESD22-C101
JEDEC Standard J-STD-020A
1. Ground / thermal vias are critical for the proper performance
of t
his device. Vias should use a .35mm (#80 / .0135”)
diameter drill and have a final plated thru diameter of .25 mm
(.010”).
2. Add as much copper as possible to inner and outer layers near
the part to ensure optimal thermal performance.
3. Mounting screws can be added near the part to fasten the
board to a heatsink. Ensure that the ground / thermal via
region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board in the
region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material and
construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are in
degrees.
MTTF vs. GND Lead Temperature
1
10
100
1000
60
70
80
90
100
110
120
Ground Lead Temperature (°C)
M
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