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參數(shù)資料
| 型號： | AG103-G |
| 廠商： | TRIQUINT SEMICONDUCTOR INC |
| 元件分類： | 放大器 |
| 英文描述： | 50 MHz - 870 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | GREEN, TO-243C, SOT-89, 3 PIN |
| 文件頁數(shù)： | 4/4頁 |
| 文件大?。?/td> | 158K |
| 代理商： | AG103-G |
Specifications and information are subject to change without notice.
WJ Communications, Inc Phone 1-800-WJ1-4401 FAX: 408-577-6621 e-mail: sales@wj.com Web site: www.wj.com, www.TriQuint.com
Page 4 of 4
June 2006
AG103
High Dynamic Range Gain Block
Product Information
AG103-G (Green / Lead-free SOT-89 Package) Mechanical Information
This package is lead-free/Green/RoHS-compliant. It is compatible with both lead-free (maximum 260 °C reflow temperature) and leaded
(maximum 245 °C reflow temperature) soldering processes. The plating material on the leads is NiPdAu.
Outline Drawing
Land Pattern
Thermal Specifications
Parameter
Rating
Operating Case Temperature
-40 to +85 °C
Thermal Resistance, Rth
(1)
59 °C / W
Junction Temperature, Tj
(2)
129 °C
1. The thermal resistance is referenced from the hottest
part of the junction to the ground tab (pin 4).
2. This corresponds to the typical biasing condition of
+5V, 150 mA at an 85 °C case temperature.
A
minimum MTTF of 1 million hours is achieved for
junction temperatures below 160 °C.
Product Marking
The AG103-G will be marked with an
“103G” designator.
An alphanumeric lot
code (“XXXX-X”) is also marked below the
part designator on the top surface of the
package.
The obsolete tin-lead package is
marked
with
an
“AG103”
designator
followed by an alphanumeric lot code.
Tape and reel specifications for this part are
located on the website in the “Application
Notes” section.
MSL / ESD Rating
ESD Rating: Class 1B
Value:
Passes
500V to <1000V
Test:
Human Body Model (HBM)
Standard:
JEDEC Standard JESD22-A114
ESD Rating: Class IV
Value:
Passes
1000V to <2000V
Test:
Charged Device Model (CDM)
Standard:
JEDEC Standard JESD22-C101
MSL Rating: Level 3 at +260 °C convection reflow
Standard:
JEDEC Standard J-STD-020
Mounting Config. Notes
1. Ground / thermal vias are critical for the proper
performance of this device. Vias should use a .35mm
(#80 / .0135”) diameter drill and have a final plated
thru diameter of .25 mm (.010”).
2. Add as much copper as possible to inner and outer
layers near the part to ensure optimal thermal
performance.
3. Mounting screws can be added near the part to fasten
the board to a heatsink.
Ensure that the ground /
thermal via region contacts the heatsink.
4. Do not put solder mask on the backside of the PC board
in the region where the board contacts the heatsink.
5. RF trace width depends upon the PC board material
and construction.
6. Use 1 oz. Copper minimum.
7. All dimensions are in millimeters (inches). Angles are
in degrees.
MTTF vs. GND Tab Temperature
1
10
100
1000
60
70
80
90
100
110
Tab Temperature (°C)
M
T
F
(m
il
li
o
n
h
r
s
)
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