3-8 Revision 4 Theta-JA Junction-to-ambient thermal resistance ( JA
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� AFS600-2PQ208
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 177/334闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC FPGA 4MB FLASH 600K 208PQFP
妯欐簴鍖呰锛� 24
绯诲垪锛� Fusion®
RAM 浣嶇附瑷堬細 110592
杓稿叆/杓稿嚭鏁�(sh霉)锛� 95
闁€鏁�(sh霉)锛� 600000
闆绘簮闆诲锛� 1.425 V ~ 1.575 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� 0°C ~ 85°C
灏佽/澶栨锛� 208-BFQFP
渚涙噳鍟嗚ō鍌欏皝瑁濓細 208-PQFP锛�28x28锛�
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DC and Power Characteristics
3-8
Revision 4
Theta-JA
Junction-to-ambient thermal resistance (
JA) is determined under standard conditions specified by
JEDEC (JESD-51), but it has little relevance in actual performance of the product. It should be used with
caution but is useful for comparing the thermal performance of one package to another.
A sample calculation showing the maximum power dissipation allowed for the AFS600-FG484 package
under forced convection of 1.0 m/s and 75掳C ambient temperature is as follows:
EQ 4
where
EQ 5
The power consumption of a device can be calculated using the Microsemi power calculator. The
device's power consumption must be lower than the calculated maximum power dissipation by the
package. If the power consumption is higher than the device's maximum allowable power dissipation, a
heat sink can be attached on top of the case, or the airflow inside the system must be increased.
Theta-JB
Junction-to-board thermal resistance (
JB) measures the ability of the package to dissipate heat from the
surface of the chip to the PCB. As defined by the JEDEC (JESD-51) standard, the thermal resistance
from junction to board uses an isothermal ring cold plate zone concept. The ring cold plate is simply a
means to generate an isothermal boundary condition at the perimeter. The cold plate is mounted on a
JEDEC standard board with a minimum distance of 5.0 mm away from the package edge.
Theta-JC
Junction-to-case thermal resistance (
JC) measures the ability of a device to dissipate heat from the
surface of the chip to the top or bottom surface of the package. It is applicable for packages used with
external heat sinks. Constant temperature is applied to the surface in consideration and acts as a
boundary condition. This only applies to situations where all or nearly all of the heat is dissipated through
the surface in consideration.
Calculation for Heat Sink
For example, in a design implemented in an AFS600-FG484 package with 2.5 m/s airflow, the power
consumption value using the power calculator is 3.00 W. The user-dependent Ta and Tj are given as
follows:
From the datasheet:
EQ 6
JA = 19.00掳C/W (taken from Table 3-6 on page 3-7).
TA
= 75.00掳C
TJ = 100.00掳C
TA = 70.00掳C
JA = 17.00掳C/W
JC = 8.28掳C/W
Maximum Power Allowed
TJ(MAX) TA(MAX)
鈥�
JA
---------------------------------------------
=
Maximum Power Allowed
100.00掳C 75.00掳C
鈥�
19.00掳C/W
----------------------------------------------------
1.3 W
==
P
TJ TA
鈥�
JA
-------------------
100掳C 70掳C
鈥�
17.00 W
------------------------------------
1.76 W
==
=
鐩搁棞PDF璩囨枡
PDF鎻忚堪
FMC12DREH-S734 CONN EDGECARD 24POS .100 EYELET
HSC60DRTN-S13 CONN EDGECARD 120PS .100 EXTEND
HSC60DRTH-S13 CONN EDGECARD 120PS .100 EXTEND
HSC60DREN-S13 CONN EDGECARD 120PS .100 EXTEND
HSC60DREH-S13 CONN EDGECARD 120PS .100 EXTEND
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