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鍙冩暩(sh霉)璩囨枡
| 鍨嬭櫉锛� | AFS250-2FGG256 |
| 寤犲晢锛� | Microsemi SoC |
| 鏂囦欢闋佹暩(sh霉)锛� | 33/334闋� |
| 鏂囦欢澶�?銆�?/td> | 0K |
| 鎻忚堪锛� | IC FPGA 2MB FLASH 250K 256FBGA |
| 妯欐簴鍖呰锛� | 90 |
| 绯诲垪锛� | Fusion® |
| RAM 浣嶇附瑷堬細 | 36864 |
| 杓稿叆/杓稿嚭鏁�(sh霉)锛� | 114 |
| 闁€鏁�(sh霉)锛� | 250000 |
| 闆绘簮闆诲锛� | 1.425 V ~ 1.575 V |
| 瀹夎椤炲瀷锛� | 琛ㄩ潰璨艰 |
| 宸ヤ綔婧害锛� | 0°C ~ 85°C |
| 灏佽/澶栨锛� | 256-LBGA |
| 渚涙噳鍟嗚ō鍌欏皝瑁濓細 | 256-FPBGA锛�17x17锛� |
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Device Architecture
2-112
Revision 4
Sample time is computed based on the period of ADCCLK.
Distribution Phase
The second phase is called the distribution phase. During distribution phase, the ADC computes the
equivalent digital value from the value stored in the input capacitor. In this phase, the output signal
SAMPLE goes back to '0', indicating the sample is completed; but the BUSY signal remains '1', indicating
the ADC is still busy for distribution. The distribution time depends strictly on the number of bits. If the
ADC is configured as a 10-bit ADC, then 10 ADCCLK cycles are needed. EQ 8 describes the distribution
time.
EQ 21
N: Number of bits
Post-Calibration Phase
The last phase is the post-calibration phase. This is an optional phase. The post-calibration phase takes
two ADCCLK cycles. The output BUSY signal will remain '1' until the post-calibration phase is completed.
If the post-calibration phase is skipped, then the BUSY signal goes to '0' after distribution phase. As soon
as BUSY signal goes to '0', the DATAVALID signal goes to '1', indicating the digital result is available on
the RESULT output signals. DATAVAILD will remain '1' until the next ADCSTART is asserted. Microsemi
recommends enabling post-calibration to compensate for drift and temperature-dependent effects. This
ensures that the ADC remains consistent over time and with temperature. The post-calibration phase is
enabled by bit 3 of the Mode register. EQ 9 describes the post-calibration time.
EQ 22
MODE[3]: Bit 3 of the Mode register, described in Table 2-41 on page 2-109.
The calculation for the conversion time for the ADC is summarized in EQ 23.
tconv = tsync_read + tsample + tdistrib + tpost-cal + tsync_write
EQ 23
tconv: conversion time
tsync_read: maximum time for a signal to synchronize with SYSCLK. For calculation purposes, the
worst case is a period of SYSCLK, tSYSCLK.
tsample: Sample time
tdistrib: Distribution time
tpost-cal: Post-calibration time
tsync_write: Maximum time for a signal to synchronize with SYSCLK. For calculation purposes, the
worst case is a period of SYSCLK, tSYSCLK.
Intra-Conversion
Performing a conversion during power-up calibration is possible but should be avoided, since the
performance is not guaranteed, as shown in Table 2-49 on page 2-120. This is described as intra-
conversion. Figure 2-92 on page 2-115 shows intra-conversion (conversion that starts during power-up
calibration).
Injected Conversion
A conversion can be interrupted by another conversion. Before the current conversion is finished, a
second conversion can be started by issuing a pulse on signal ADCSTART. When a second conversion
is issued before the current conversion is completed, the current conversion would be dropped and the
ADC would start the second conversion on the rising edge of the SYSCLK. This is known as injected
conversion. Since the ADC is synchronous, the minimum time to issue a second conversion is two clock
cycles of SYSCLK after the previous one. Figure 2-93 on page 2-116 shows injected conversion
Table 2-46 STC Bits Function
Name
Bits
Function
STC
[7:0]
Sample time control
tdistrib
NtADCCLK
=
tpost-cal
MODE 3
2tADCCLK
=
鐩搁棞PDF璩囨枡 |
PDF鎻忚堪 |
|---|---|
| M1AFS250-2FG256 | IC FPGA 2MB FLASH 250K 256-FBGA |
| AFS250-2FG256 | IC FPGA 2MB FLASH 250K 256FBGA |
| IDT71V424S15YG | IC SRAM 4MBIT 15NS 36SOJ |
| IDT71V424S10PHG | IC SRAM 4MBIT 10NS 44TSOP |
| M1AFS250-2FGG256 | IC FPGA 2MB FLASH 250K 256-FBGA |
鐩搁棞浠ｇ悊鍟�/鎶€琛撳弮鏁�(sh霉) |
鍙冩暩(sh霉)鎻忚堪 |
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| AFS250-2FGG256ES | 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:Actel Fusion Mixed-Signal FPGAs |
| AFS250-2FGG256I | 鍔熻兘鎻忚堪:IC FPGA 2MB FLASH 250K 256FBGA RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄ｅ垪锛� 绯诲垪:Fusion® 妯欐簴鍖呰:40 绯诲垪:SX-A LAB/CLB鏁�(sh霉):6036 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:- 杓稿叆/杓稿嚭鏁�(sh霉):360 闁€鏁�(sh霉):108000 闆绘簮闆诲:2.25 V ~ 5.25 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 70°C 灏佽/澶栨:484-BGA 渚涙噳鍟嗚ō鍌欏皝瑁�:484-FPBGA锛�27X27锛� |
| AFS250-2FGG256PP | 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:Actel Fusion Mixed-Signal FPGAs |
| AFS250-2PQ208 | 鍔熻兘鎻忚堪:IC FPGA 2MB FLASH 250K 208PQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄ｅ垪锛� 绯诲垪:Fusion® 妯欐簴鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳鍟嗚ō鍌欏皝瑁�:256-FPBGA锛�17x17锛� |
| AFS250-2PQ208I | 鍔熻兘鎻忚堪:IC FPGA 2MB FLASH 250K 208PQFP RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄ｅ垪锛� 绯诲垪:Fusion® 妯欐簴鍖呰:40 绯诲垪:SX-A LAB/CLB鏁�(sh霉):6036 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:- 杓稿叆/杓稿嚭鏁�(sh霉):360 闁€鏁�(sh霉):108000 闆绘簮闆诲:2.25 V ~ 5.25 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:0°C ~ 70°C 灏佽/澶栨:484-BGA 渚涙噳鍟嗚ō鍌欏皝瑁�:484-FPBGA锛�27X27锛� |
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