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鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� AFS250-1QNG180
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 261/334闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC FPGA 2MB FLASH 250K 180-QFN
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 184
绯诲垪锛� Fusion®
RAM 浣嶇附瑷堬細 36864
杓稿叆/杓稿嚭鏁�(sh霉)锛� 65
闁€鏁�(sh霉)锛� 250000
闆绘簮闆诲锛� 1.425 V ~ 1.575 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� 0°C ~ 85°C
灏佽/澶栨锛� 180-WFQFN
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 180-QFN锛�10x10锛�
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Fusion Family of Mixed Signal FPGAs
Revision 4
5-17
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheet parameters are published before
data has been fully characterized from silicon devices. The data provided for a given device, as
highlighted in the "Fusion Device Status" table, is designated as either "Product Brief," "Advance,"
"Preliminary," or "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general
product information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the
DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not
been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Production
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations (EAR).
They could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
Safety Critical, Life Support, and High-Reliability Applications
Policy
The products described in this advance status document may not have completed the Microsemi
qualification process. Products may be amended or enhanced during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the responsibility of
each customer to ensure the fitness of any product (but especially a new product) for a particular
purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications.
Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating
to life-support applications. A reliability report covering all of the SoC Products Group鈥檚 products is
available at http://www.microsemi.com/soc/documents/ORT_Report.pdf. Microsemi also offers a variety
of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for
additional reliability information.
鐩搁棞(gu膩n)PDF璩囨枡
PDF鎻忚堪
RGM43DTBT CONN EDGECARD 86POS R/A .156 SLD
M1AFS250-1QNG180 IC FPGA 2MB FLASH 250K 180-QFN
EPF8820AQC160-4 IC FLEX 8000A FPGA 8K 160-PQFP
RSM43DTAT CONN EDGECARD 86POS R/A .156 SLD
M1A3P600-1FGG256 IC FPGA 1KB FLASH 600K 256-FBGA
鐩搁棞(gu膩n)浠g悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
AFS250-1QNG180I 鍔熻兘鎻忚堪:IC FPGA 2MB FLASH 250K 180-QFN RoHS:鏄� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:Fusion® 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛�
AFS250-1QNG256ES 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:Actel Fusion Mixed-Signal FPGAs
AFS250-1QNG256I 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:Actel Fusion Mixed-Signal FPGAs
AFS250-1QNG256PP 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:Actel Fusion Mixed-Signal FPGAs
AFS250-2FG256 鍔熻兘鎻忚堪:IC FPGA 2MB FLASH 250K 256FBGA RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 宓屽叆寮� - FPGA锛堢従(xi脿n)鍫村彲绶ㄧ▼闁€闄e垪锛� 绯诲垪:Fusion® 妯�(bi膩o)婧�(zh菙n)鍖呰:90 绯诲垪:ProASIC3 LAB/CLB鏁�(sh霉):- 閭忚集鍏冧欢/鍠厓鏁�(sh霉):- RAM 浣嶇附瑷�:36864 杓稿叆/杓稿嚭鏁�(sh霉):157 闁€鏁�(sh霉):250000 闆绘簮闆诲:1.425 V ~ 1.575 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 宸ヤ綔婧害:-40°C ~ 125°C 灏佽/澶栨:256-LBGA 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:256-FPBGA锛�17x17锛�